Liquid Encapsulated Semiconductor Module With Pressure Compensation
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Solution Overview
Problem
Modern power modules face challenges in protecting and electrically isolating power electronic circuitry due to harsh environmental conditions and heat generation, particularly in maintaining a stable and impermeable encapsulant that can thermally expand and contract without leaking.
Innovation Solution
A semiconductor module with a liquid electrically insulating encapsulant and a pressure compensation element that maintains constant pressure during thermal expansion and contraction, preventing leakage and ensuring the encapsulant remains stable across operational temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a solid encapsulant is used to protect and electrically isolate the power electronic circuitry, then the circuitry is protected from harsh environmental conditions, but the encapsulant may crack or separate from the encapsulated elements due to thermal expansion and contraction
Solution Approach 1:
The patent changes the physical state of the encapsulant from solid to liquid, which fundamentally alters its mechanical properties. The liquid encapsulant can flow and adapt to thermal expansion and contraction without cracking or separating, while still providing electrical isolation and protection. This parameter change resolves the contradiction between maintaining protection reliability and preserving encapsulant integrity under thermal cycling conditions.
2Adaptability or versatility
If the encapsulant is allowed to thermally expand and contract, then the encapsulant can accommodate temperature variations, but the encapsulant may leak from the module
Solution Approach 1:
The patent employs a flexible seal structure that can deform elastically to accommodate the thermal expansion and contraction of the liquid encapsulant. The seal includes a diaphragm or membrane that flexes outward when the encapsulant expands and returns when it contracts, preventing leakage while allowing thermal adaptation. This resolves the contradiction between thermal adaptability and substance retention.
3Loss of energy
If a liquid encapsulant is used to prevent cracking and improve thermal management, then heat transfer efficiency is improved, but the liquid must be prevented from leaking
Solution Approach 1:
The flexible seal structure with a diaphragm or membrane allows the liquid encapsulant to expand and contract thermally without leaking. The seal flexes elastically to accommodate volume changes while maintaining containment, enabling the use of liquid encapsulant for superior heat transfer without suffering from leakage problems that would undermine energy management efficiency.
4Adaptability or versatility
If the encapsulant volume changes with temperature, then thermal expansion is accommodated, but pressure builds up inside the sealed module
Solution Approach 1:
The flexible seal structure with a deformable diaphragm or membrane provides a pressure relief mechanism. When the liquid encapsulant expands thermally, the diaphragm flexes outward, accommodating the increased volume and preventing pressure buildup. This resolves the contradiction between thermal expansion accommodation and pressure control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective electrical isolation, prevents cracking, and efficiently transfers heat away from hotspots, maintaining the encapsulant's integrity and operational stability under varying temperatures.
Implementation Method 1
efficiently transfers heat away from hotspots
Implementation Method 2
during thermal expansion and thermal contraction of the electrically insulating encapsulant
Implementation Method 3
during thermal expansion and thermal contraction of the electrically insulating encapsulant
Data Source
AI summary
A semiconductor module includes a power electronics carrier including a metallization layer disposed on an electrically insulating substrate, a power semiconductor die mounted on the power electronics carrier, a housing that surrounds an interior volume over the power electronics carrier, a volume of electrically insulating encapsulant that fills the interior volume and encapsulates the power semiconductor die, and a pressure compensation element disposed on or within the electrically insulating encapsulant, wherein the electrically insulating encapsulant is a liquid, wherein the semiconductor module forms an impermeable seal that contains the volume of electrically insulating encapsulant, and wherein the pressure compensation element is configured to maintain the electrically insulating encapsulant at a substantially constant pressure during thermal expansion and thermal contraction of the electrically insulating encapsulant.