Liquid-Filled Hollow Electrical Connection for Power Semiconductor Thermal Management
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Solution Overview
Problem
Power semiconductor devices face challenges with heat dissipation due to their high current conduction, leading to performance degradation at elevated temperatures, as conventional packaging methods are inefficient in managing thermal conductivity.
Innovation Solution
The implementation of an electrical connection element with a liquid-filled hollow space, encapsulated within a conductive shell, providing enhanced thermal and electrical conductivity by leveraging thermal convection, which is up to 100 times better than traditional metal connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional metal connections are used for electrical connection, then the structure is simple and easy to manufacture, but the thermal conduction efficiency is insufficient leading to poor heat dissipation
Solution Approach 1:
The patent implements a hollow electrical connection element with a core structure that contains a capillary network filled with liquid. The liquid-filled capillaries are nested within the hollow space of the electrical connection element, creating a multi-layered nested structure where the liquid cooling channel is embedded inside the electrical conductor, maximizing thermal contact while maintaining electrical conductivity.
Solution Approach 2:
The electrical connection element combines multiple materials with complementary properties: a conductive shell material for electrical conductivity, a core material providing structural support, and a liquid coolant for thermal management. This composite structure integrates electrical conduction and thermal conduction functions that neither material could achieve alone.
2Reliability
If liquid-filled hollow space electrical connection is implemented, then thermal conduction improves up to 100 times, but the manufacturing process becomes more complex
Solution Approach 1:
The capillary network structure is pre-formed within the core material before the final assembly step. The liquid coolant is introduced into the pre-formed capillaries through vacuum filling or pressure injection methods, allowing the complex internal structure to be prepared in advance rather than requiring complex post-assembly operations.
Solution Approach 2:
The patent utilizes hydraulic principles for filling the liquid coolant into the hollow space and capillary network. Pressure-driven fluid injection or vacuum-assisted filling methods are employed to efficiently introduce the liquid coolant into the complex internal channels, simplifying the manufacturing process compared to traditional sealing and filling methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly improves cooling efficiency, allowing power semiconductor devices to operate effectively at higher temperatures by combining the conductivity of metals with the thermal convection properties of liquids within the connection element.
Implementation Method 1
the first electrical connection comprises a first liquid... provides enhanced thermal and electrical conductivity, offering up to 100 times better thermal conduction compared to traditional metal connections
Implementation Method 2
a conductive shell with a core that includes a capillary structure filled with liquids
Implementation Method 3
provides enhanced thermal and electrical conductivity, offering up to 100 times better thermal conduction
Data Source
AI summary
A system and method for manufacturing an electric device package are disclosed. An embodiment comprises a carrier, a component disposed on the carrier, the component having a first component contact pad, and a first electrical connection between the first component contact pad and a first carrier contact pad, wherein the first electrical connection comprises a first hollow space, the first hollow space comprising a first liquid.