Liquid Flow Controller Preheating for Accurate Precursor Delivery
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Solution Overview
Problem
Conventional methods for delivering precursors to semiconductor processing chambers suffer from temperature differences between liquid flow control devices and incoming liquids, leading to flow rate errors and non-uniform deposition rates across wafers and chambers, necessitating inefficient temperature equilibrium priming processes that waste time and gases.
Innovation Solution
Preheating liquids to a temperature matching that of the liquid flow control device using a heater and temperature sensor feedback loop to minimize temperature differences, eliminating the need for lengthy priming processes and improving flow accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If liquid is delivered directly to the liquid flow controller without preheating, then the system structure is simple, but temperature differences cause flow rate errors and reduced manufacturing precision
Solution Approach 1:
The liquid is preheated in a heater before being delivered to the liquid flow controller. This preliminary heating action ensures that the liquid temperature matches the controller body temperature, eliminating thermal expansion effects that cause flow rate errors, thereby improving flow rate accuracy without significantly complicating the system
Solution Approach 2:
A heater is introduced as an intermediary component between the liquid source and the liquid flow controller. This intermediary device adjusts the liquid temperature to match the controller body temperature, preventing temperature-induced flow rate errors while maintaining overall system functionality
2Manufacturing precision
If temperature equilibrium priming process is used, then flow accuracy is improved, but processing time increases and gases are wasted
Solution Approach 1:
The liquid is preheated before entering the liquid flow controller, establishing temperature equilibrium in advance. This eliminates the need for lengthy priming processes that were previously required to achieve thermal equilibrium, thereby reducing processing time while maintaining flow rate accuracy
Solution Approach 2:
The temperature difference between liquid and controller, which previously caused flow rate errors and necessitated priming processes, is converted into a benefit by preheating the liquid. This converts the potential harmful temperature mismatch into a controlled condition that improves flow accuracy from the start of operation
3Manufacturing precision
If temperature equilibrium priming process is used, then flow accuracy is improved, but consumption of gases increases
Solution Approach 1:
The liquid is preheated before entering the liquid flow controller, establishing temperature equilibrium in advance. This eliminates the need for priming processes that consume process gases, thereby reducing gas waste while maintaining flow rate accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances deposition rate uniformity across wafers and chambers, reduces processing time, and minimizes waste by eliminating or shortening priming processes, thereby increasing operational efficiency.
Implementation Method 1
The heater may preheat a liquid supplied by the liquid delivery source to a temperature that is within about 5° C. of a temperature of a body of the liquid flow controller
Implementation Method 2
The methods may include vaporizing the liquid into a gas
Data Source
AI summary
Exemplary fluid delivery assemblies for a semiconductor processing system may include a liquid delivery source. The assemblies may include a heater that is fluidly coupled with an outlet of the liquid delivery source. The assemblies may include a liquid flow controller that is fluidly coupled with the liquid delivery source downstream of the heater. The assemblies may include a liquid vaporizer fluidly coupled with a downstream end of the liquid flow controller. The assemblies may include a chamber delivery line coupled with an output of the liquid vaporizer.