Liquid Flowrate Control Device Solvent Purging for TEMAZ Vaporizer
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Solution Overview
Problem
In substrate processing for semiconductor devices, the use of tetrakis ethylmethyl amino zirconium (TEMAZ) poses challenges due to its low vapor pressure, requiring heating which leads to thermal decomposition, and existing methods for cleaning and confirming the operation of liquid flowrate control devices are time-consuming and prone to contamination.
Innovation Solution
A substrate processing apparatus that utilizes a solvent with higher vapor pressure than TEMAZ to confirm the operation of the liquid flowrate control device before introducing the TEMAZ, reducing the need for extensive cleaning and replacement processes, and preventing contamination by using the solvent for cleaning the vaporizer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If TEMAZ is heated to increase vapor pressure for sufficient flowrate, then the vapor pressure increases, but thermal decomposition occurs
Solution Approach 1:
The patent introduces a heating assistant gas (inert gas) as an intermediary medium to transfer heat to the TEMAZ liquid indirectly. The inert gas flows through the heating section, absorbs heat from the heating element, and then transfers this heat to the TEMAZ, increasing its vapor pressure without direct contact with high-temperature surfaces that would cause decomposition
Solution Approach 2:
The patent changes the physical parameters of the system by introducing a third substance (heating assistant gas) that modifies the heat transfer mechanism. Instead of direct heating of TEMAZ that causes decomposition, the system uses the inert gas as a heat carrier, changing the temperature profile and heat transfer path to achieve vaporization without thermal decomposition
2Reliability
If liquid mass flow controller is replaced and operation confirmed using TEMAZ, then defect detection is possible, but contamination occurs and extensive cleaning is required
Solution Approach 1:
The patent performs preliminary testing using inert gas flow before introducing TEMAZ to the liquid mass flow controller. By confirming proper operation with the inert gas first, the system avoids contamination that would occur if TEMAZ were used for testing. This preliminary action with a non-contaminating substance enables defect detection without the harmful effects of TEMAZ exposure
Solution Approach 2:
The inert gas serves as an intermediary testing medium that allows operation confirmation without direct use of TEMAZ. The inert gas flows through the liquid mass flow controller during preliminary testing, enabling defect detection while preventing contamination of the controller and surrounding components that would occur with TEMAZ
3Object-generated harmful factors
If solvent cleaning process is performed to remove residual TEMAZ, then contamination is reduced, but processing time increases
Solution Approach 1:
The patent performs preliminary purging with inert gas before the solvent cleaning process. This preliminary action removes the majority of residual TEMAZ through gas flow, reducing the amount of solvent needed and the time required for the subsequent solvent cleaning step, thereby reducing overall contamination and processing time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the time and labor required for defect detection and replacement in the liquid flowrate control device, while preventing contamination and maintaining efficient film formation on substrates.
Implementation Method 1
a solvent having a vapor pressure greater than that of the liquid source
Data Source
AI summary
A substrate processing apparatus, a method of manufacturing a semiconductor device, and a method of confirming an operation of a liquid flowrate control device are provided. The substrate processing apparatus comprises: a process chamber accommodating a substrate; a liquid source supply system supplying a liquid source into the process chamber; a solvent supply system supplying a solvent having a vapor pressure greater than that of the liquid source into the process chamber; a liquid flowrate control device controlling flowrates of the liquid source and the solvent; and a controller controlling the liquid source supply system, the solvent supply system, and the liquid flowrate control device so that the solvent is supplied into the liquid flowrate control device than the solvent supply system to confirm an operation of the liquid flowrate control device before the liquid source supply system supplies the liquid source into the process chamber.