Liquid Guiding Structure Arrays for Photonic Adhesive Shaping
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Solution Overview
Problem
Existing methods for applying adhesive materials on substrates, such as photonic integrated circuits, struggle with precise control over thickness and distribution due to surface topography, leading to assembly and performance issues, and existing dam structures are ineffective in counteracting liquid surface energy.
Innovation Solution
The use of liquid guiding (LG) structures arranged in a two-dimensional pattern on the substrate surface to control the 3D distribution of adhesive materials, acting as capillaries to direct and stop the spread, ensuring precise height and shape control through capillary flow and wicking action.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If adhesive material is applied on substrate surface with existing methods, then adhesive coverage is achieved, but thickness and distribution control is poor due to surface topography
Solution Approach 1:
The patent applies preliminary action by pre-fabricating three-dimensional relief structures on the substrate surface before adhesive application. These relief structures create physical boundaries that guide adhesive flow and define the final adhesive thickness, eliminating the need for complex real-time control during adhesive application while achieving precise thickness uniformity despite surface topography variations
2Manufacturing precision
If dam structures are used to control adhesive spread, then adhesive distribution is constrained, but liquid surface energy is not effectively counteracted
Solution Approach 1:
The patent applies parameter changes by modifying the physical geometry of the substrate surface through three-dimensional relief structures with specific height profiles and spacing. These structural parameters create capillary channels that generate capillary pressure to counteract liquid surface energy, providing reliable adhesive confinement without requiring traditional dam structures. The relief structure dimensions are engineered to control adhesive flow and define precise thickness profiles
3Area of stationary object
If adhesive is applied uniformly across substrate, then coverage is maximized, but interference with optical and electrical components increases
Solution Approach 1:
The patent applies local quality by creating spatially varying relief structures across the substrate surface, with different height profiles and spacing patterns in different regions. This allows the adhesive to be confined to specific areas where it is needed, while leaving other regions free of adhesive interference. The relief structures act as localized boundaries that guide adhesive flow to target zones, maximizing coverage in critical areas while minimizing interference with sensitive optical and electrical components in other areas
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise application and curing of adhesive materials at the wafer-level with controlled thickness and shape, minimizing interference with optical and electrical components, and ensuring optimal performance of integrated photonic structures.
Implementation Method 1
acting as capillaries to direct and stop the spread, ensuring precise height and shape control through capillary flow and wicking action
Implementation Method 2
acting as capillaries to direct and stop the spread, ensuring precise height and shape control through capillary flow and wicking action
Implementation Method 3
The adhesive material has been cured by ultraviolet light
Data Source
AI summary
An article of manufacture comprises: at least a portion of a wafer comprising a substrate and one or more layers fabricated on the substrate; one or more integrated photonic structures in the portion of the wafer, where at least a first integrated photonic structure of the one or more integrated photonic structures is associated with an electromagnetic wave propagation region that extends beyond a first surface of a first layer of the one or more layers; an array of liquid guiding structures arranged in a two-dimensional pattern on a portion of the first surface of the first layer; and an adhesive material making contact with the first surface of the first layer and with at least a majority of the liquid guiding structures in the array of liquid guiding structures.