Liquid Guiding Assembly with Layered Heat Transfer for Viscous Aerosols
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Solution Overview
Problem
High-viscosity aerosol-forming materials in electronic atomization devices lead to poor fluidity, liquid guiding obstruction, and ventilation bubble blockage, resulting in dry heating and reduced device lifespan.
Innovation Solution
A liquid guiding assembly with stacked thermal conduction and isolation layers, where the isolation layer isolates the thermal conduction layer from the heating element and transfers heat to it, improving fluidity and preventing ventilation channel blockage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If high-viscosity aerosol-forming materials are used, then the material can be delivered to users, but the fluidity becomes poor leading to liquid guiding obstruction
Solution Approach 1:
The patent changes the temperature parameter of the aerosol-forming material by introducing a thermal conduction layer that heats the material. This temperature increase reduces the viscosity and improves fluidity, allowing high-viscosity materials to flow properly through the liquid guiding assembly without obstruction.
Solution Approach 2:
The thermal conduction layer acts as an intermediary between the heating element and the aerosol-forming material. It transfers heat from the heating element to the material, enabling temperature-controlled viscosity adjustment without direct contact between the heating element and the material.
2Quantity of substance
If high-viscosity aerosol-forming materials are used, then the material can be delivered, but ventilation bubbles flow is impeded causing blockage
Solution Approach 1:
By increasing the temperature of the aerosol-forming material through the thermal conduction layer, the viscosity is reduced. This parameter change allows ventilation bubbles to flow more freely through the liquid guiding assembly, preventing blockage and ensuring proper ventilation.
3Use of energy by moving object
If thermal conduction layer is in direct contact with heating element, then heat transfer is efficient, but liquid guiding obstruction occurs
Solution Approach 1:
The isolation layer serves as an intermediary between the heating element and the thermal conduction layer. It prevents direct contact while allowing heat transfer, thus avoiding liquid guiding obstruction caused by direct heating element contact while maintaining thermal efficiency.
Solution Approach 2:
The patent segments the heating structure into distinct functional layers: the heating element, the isolation layer, and the thermal conduction layer. This segmentation allows each layer to perform its specific function independently, preventing direct contact issues while maintaining heat transfer efficiency.
4Ease of operation
If isolation layer is added between thermal conduction layer and heating element, then liquid guiding obstruction is prevented, but heat transfer is reduced
Solution Approach 1:
The isolation layer is designed with specific local properties (thickness, material composition) that optimize the balance between preventing direct contact and allowing heat transfer. The local quality of the isolation layer ensures minimal thermal resistance while maintaining the protective function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances fluidity of aerosol-forming materials, facilitates ventilation, and improves liquid guiding and atomization efficiency, extending the device's service life and user experience.
Implementation Method 1
the at least one isolation layer is configured to transfer at least some heat generated by the heating element to the at least one thermal conduction layer
Data Source
AI summary
A liquid guiding assembly for an electronic atomization device includes: at least one thermal conduction layer and at least one isolation layer that are stacked. The at least one isolation layer makes contact with a heating element of the electronic atomization device, the at least one isolation layer isolating the thermal conduction layer from the heating element. The at least one isolation layer transfers at least some heat generated by the heating element to the at least one thermal conduction layer.


