Liquid Ejecting Head With Heat-Activated Adhesive Repair
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Solution Overview
Problem
Existing liquid ejecting heads face challenges in component replacement and repair due to adhesive bonding, making it difficult to regenerate the head when parts fail.
Innovation Solution
A liquid ejecting head design that includes a head chip with nozzles, a holder, and a heating element to plasticize the adhesive, allowing for easier disassembly and repair by controlling the adhesive's state.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If components are bonded with adhesive to ensure strong connection, then bonding strength is improved, but ease of repair and component replacement deteriorates
Solution Approach 1:
The adhesive's physical state is made dynamic by introducing a heating element. The adhesive transitions from a solid bonded state during operation to a plasticized reversible state during repair. This allows the bonding mechanism to switch between providing strong connection and enabling easy separation based on operational needs.
Solution Approach 2:
The temperature parameter of the adhesive is changed to control its properties. By heating the adhesive with the heating element, its glass transition temperature is temporarily exceeded, causing it to plasticize and become reversible. This parameter change enables the adhesive to function differently under thermal conditions, allowing both strong bonding and easy repair.
2Reliability
If adhesive is used to bond components for structural integrity, then reliability is improved, but ease of manufacture and assembly deteriorates
Solution Approach 1:
The heating element is pre-installed within the structure during manufacturing, positioned to directly heat the adhesive during assembly. This preliminary preparation enables the adhesive to be plasticized in-situ during assembly operations, allowing components to be bonded and separated as needed without requiring special tools or complex procedures.
Solution Approach 2:
The adhesive system becomes self-regulating through the integrated heating element. When heating is applied, the adhesive automatically plasticizes and becomes reversible, enabling self-contained bond breaking without external intervention. This self-service capability simplifies assembly and disassembly operations while maintaining structural integrity during normal operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easier disassembly and repair of components, enhancing the maintainability and longevity of the liquid ejecting head.
Implementation Method 1
a heating element that plasticizes the adhesive
Data Source
AI summary
A head chip that includes a nozzle plate having a plurality of nozzles configure to eject a liquid, another member different from the head chip, an adhesive that bonds the head chip and the other member, and a heating element configured to plasticize the adhesive are provided.