Liquid Ejecting Head Regeneration With Clean Coupling Interfaces
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Solution Overview
Problem
Existing liquid ejecting heads face challenges in regenerating or reusing head chips due to adhesive interference during separation, making it difficult to achieve liquid-tight adhesion when replacing or reusing the head chips.
Innovation Solution
A method for regenerating a liquid ejecting head by replacing a first head chip with a compatible second head chip, involving a step to release the adhesion state of the first selection coupling portion and liquid-tightly coupling the second selection coupling portion with an adhesive, and reusing a portion of a first liquid ejecting head by releasing the adhesion state of the chip-side coupling portion and coupling it with a compatible second flow path structure using an adhesive.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive is used to couple the head chip and flow path structure, then liquid-tight adhesion is achieved, but adhesive remains on the surfaces and interferes with reuse or regeneration
Solution Approach 1:
The coupling interface is divided into a first coupling surface and a second coupling surface, with adhesive applied only to the first surface. This segmentation allows the second surface to remain clean and free of adhesive residue, enabling successful reuse or regeneration of the head chip without interference from remaining adhesive.
2Reliability
If adhesive is applied to ensure liquid-tight coupling, then sealing is improved, but adhesive residue prevents proper adhesion during regeneration
Solution Approach 1:
The first coupling surface is prepared in advance with adhesive application, while the second coupling surface is kept free of adhesive. This preliminary differentiation ensures that when regeneration is needed, the second surface can accept new adhesive without interference from residual adhesive, streamlining the regeneration manufacturing process.
3Strength
If adhesive is used to bond the head chip to flow path structure, then connection strength is improved, but adhesive remaining on surfaces prevents successful reconnection
Solution Approach 1:
Adhesive is applied locally only to the first coupling surface rather than uniformly across both surfaces. This local quality differentiation ensures strong connection at the first interface while leaving the second interface clean and ready for future reconnection operations, thereby maintaining head chip reusability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables effective regeneration and reuse of liquid ejecting heads by ensuring liquid-tight adhesion without adhesive interference, facilitating efficient recycling and maintenance of the liquid ejecting apparatus.
Implementation Method 1
liquid-tightly coupling the second selection coupling portion compatible with the first selection coupling portion and the second head chip by an adhesive
Data Source
AI summary
There is provided a liquid ejecting head manufacturing method of manufacturing a second liquid ejecting head by regenerating a first liquid ejecting head that includes a first head chip ejecting a liquid, and a flow path structure having a first selection coupling portion and a second selection coupling portion that are flow path coupling portions to the first head chip, the method including: a replacing step of replacing the first head chip with a second head chip compatible with the first head chip, in which the replacing step includes a first step of releasing an adhesion state where the first selection coupling portion and the first head chip are liquid-tightly coupled, and a second step of liquid-tightly coupling the second selection coupling portion compatible with the first selection coupling portion and the second head chip by an adhesive.