Liquid Ejection Head Sealing Structure for Uniform Resin Height
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Solution Overview
Problem
Existing liquid ejection heads with non-uniform gap widths between chips and a cover member face challenges in uniformly controlling the height of the sealing resin, leading to issues such as ink or dust ingress and inadequate cleaning due to uneven meniscus formation.
Innovation Solution
The introduction of protrusions in the gaps between chips and a cover member to stabilize the sealing resin height, ensuring uniform application and effective cleaning by maintaining a consistent liquid level.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the height of the sealing resin is increased to prevent ink or dust ingress, then sealing performance is improved, but the sealing resin goes on the chips and buries the ejection opening causing faulty printing
Solution Approach 1:
The patent applies different heights of sealing resin at different locations: higher sealing resin in the gaps between chips and cover member to prevent ink/dust ingress, and lower sealing resin at the ejection opening area to avoid burying the opening. This local differentiation resolves the contradiction between sealing performance and ejection function.
2Manufacturing precision
If the height of the sealing resin is decreased to avoid burying the ejection opening, then printing functionality is maintained, but gaps are produced between the suctioning mechanism and sealing resin preventing effective cleaning
Solution Approach 1:
The patent creates local quality variations in sealing resin height: lower height at ejection openings to maintain printing function, and higher height in gaps between chips and cover member to enable the suctioning mechanism to make contact and perform effective cleaning. This resolves the contradiction between printing functionality and cleaning performance.
3Manufacturing precision
If rectangular chips are disposed in parallel with uniform gaps, then control of sealing resin liquid level height is easy, but this configuration cannot avoid blank dots when chips need to be inclined to overlap nozzles
Solution Approach 1:
The patent accommodates non-uniform gap widths created by inclined chip arrangement (necessary to avoid blank dots) by applying sealing resin with locally adjusted heights. The sealing resin height is controlled to be appropriate at each specific location regardless of gap width variations, enabling both inclined chip configuration for printing quality and proper sealing resin application.
4Productivity
If a plurality of parallelogram chips are inclined diagonally to overlap nozzles and avoid blank dots, then printing quality is improved, but the widths of the gaps between chips and cover member become non-uniform making it difficult to control sealing resin height
Solution Approach 1:
The patent addresses the non-uniform gap widths resulting from inclined parallelogram chip arrangement by implementing local quality control of sealing resin height. The sealing resin is applied with varying heights tailored to each location's specific gap width, enabling both the inclined chip configuration for avoiding blank dots and controlled sealing resin application.
Solution Approach 2:
The patent changes the parameter of sealing resin height locally according to the non-uniform gap widths. By adjusting the sealing resin height parameter at different positions to match the local gap dimensions, the patent enables proper sealing even when chips are inclined at non-standard angles for optimized printing performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for controlled sealing resin height within a constant range, enhancing cleaning performance by ensuring consistent contact with the cleaning mechanism and preventing ink or dust ingress.
Implementation Method 1
When gaps are produced between the liquid ejection chips and another member such as the base substrate, ink or dust enters these gaps
Implementation Method 2
a tube that comes into contact with a surface of the liquid ejection head on which the chips are disposed, and performs suctioning while moving
Data Source
AI summary
A liquid ejection head includes a base substrate including a flow passage of liquid formed therein; chips disposed on the base substrate and configured to eject the liquid; and a cover member disposed on the base substrate so as to surround the chips. A sealing resin is applied to gaps between a plurality of the chips and the cover member, a distance of the gaps between the chips and the cover member is non-uniform, and the gaps are each provided with a protrusion.