Compact Liquid Heat-Dissipating Module for Laptops
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Solution Overview
Problem
Conventional liquid cooling systems for electronic devices, such as laptops, are bulky due to the need for multiple independent components and pipes, making them difficult to install in devices with limited interior space.
Innovation Solution
A compact liquid heat-dissipating module with a heat-absorbing unit, a fluid delivery device, and a connecting pipe forms a closed-loop, where the fluid absorbs heat from the heat-absorbing unit and is delivered back to the fluid delivery device for dissipation through a heat-dissipating structure, reducing overall volume and enabling installation in small spaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional liquid cooling system uses independent components (heat-absorber, heat-dissipater, pump) connected by multiple pipes, then the cooling function is achieved, but the total volume becomes excessive and difficult to install in limited spaces
Solution Approach 1:
The patent combines the heat-absorber, heat-dissipater, and pump into a single integrated heat-dissipating module. The heat-absorbing unit and heat-dissipating unit are stacked adjacent to each other with direct fluid communication between them, eliminating the need for external pipes and separate pump connections. This merging of previously independent components into one compact module directly resolves the volume issue while maintaining the cooling function.
2Productivity
If multiple pipes are used to connect independent cooling components, then fluid circulation is established, but the device complexity and installation difficulty increase
Solution Approach 1:
The patent integrates the fluid delivery function directly into the heat-dissipating module structure. The pump is positioned adjacent to the heat-absorbing unit with direct fluid communication, and the heat-absorbing unit is stacked adjacent to the heat-dissipating unit with direct fluid pathways between them. This eliminates multiple external pipes and connections, reducing device complexity while maintaining effective fluid circulation for heat transfer.
3Adaptability or versatility
If independent cooling components are used, then the cooling system can be designed with separate functions, but the overall system size becomes too large for miniaturized electronic devices
Solution Approach 1:
The patent employs a stacked configuration where the heat-absorbing unit and heat-dissipating unit are positioned adjacent to each other in a nested-like arrangement. The fluid delivery device is integrated within this stacked structure, with fluid pathways that navigate through the compact vertical arrangement. This nesting approach allows functional separation to be maintained while achieving a compact footprint suitable for miniaturized electronic devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module effectively dissipates heat from electronic elements while being compact enough to fit within limited interior spaces, such as a laptop computer, enhancing operational efficiency and extending the lifespan of electronic components.
Implementation Method 1
a heat-absorbing unit, being connected with the heating element, for absorbing the heat generated by the heating element
Implementation Method 2
the cooling liquid is delivered to the heat-absorber through the pump and the delivery pipe for absorbing the heat from the heat-absorber
Implementation Method 3
the fluid absorbing the heat is then delivered back to the fluid delivery device, letting the heat-dissipating structure to dissipate the heat contained in the fluid
Implementation Method 4
the cooling liquid circulates in the circular loop endlessly, for taking out the heat generated by the electronic elements successively
Data Source
AI summary
The present invention is related to a liquid heat-dissipating module, for dissipating the heat generated by a heating element, at least comprising: a heat-absorbing unit, being connected with the heating element, for absorbing the heat generated by the heating element; a fluid delivery device, for delivering a fluid, the fluid delivery device being stacked with the heat-absorbing unit and having a heat-dissipating structure; and a connecting pipe, being connected with the heat-absorbing unit and the fluid delivery device for delivering the fluid into the heat-absorbing unit, so as to absorb the heat of the heat-absorbing unit; the fluid absorbing the heat is then delivered back to the fluid delivery device, letting the heat-dissipating structure to dissipate the heat contained in the fluid.