Liquid Heat Conduction Sheet Interface for Lower Thermal Resistance
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Solution Overview
Problem
Existing heat conduction sheets face challenges in reducing thermal resistance due to increased heat generation in semiconductor packages, particularly with larger chips and lower pressure bonding, necessitating improved flexibility and thermal conductivity.
Innovation Solution
A liquid heat conduction material with a thermal conductivity of 5 W/(m·K) or more, containing heat conductive fillers and a resin component, forms a liquid layer that fills gaps between the heat conduction sheet and adherends, reducing contact thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the heat conduction sheet is made thicker to accommodate chip level difference, then the flexibility and adaptability improve, but the thermal resistance increases
Solution Approach 1:
The patent applies local quality by creating a layered structure where the heat conduction sheet has different properties in different regions: a first heat conduction layer with specific thermal conductivity and a second heat conduction layer with different characteristics. This allows the sheet to simultaneously provide adaptability to thickness variations while maintaining low thermal resistance through the optimized layered configuration.
Solution Approach 2:
The patent employs composite materials by combining multiple heat conduction layers with different thermal conductivities and compositions. The first heat conduction layer may contain inorganic particles oriented perpendicular to the sheet surface, while the second layer provides additional thermal conduction pathways, creating a composite structure that achieves both flexibility and low thermal resistance.
2Reliability
If the pressure bonding is reduced to protect chip integrity, then the chip damage risk decreases, but the contact between heat conduction sheet and adherend becomes poor
Solution Approach 1:
The patent uses flexible thin films by designing a heat conduction sheet with sufficient flexibility to conform to surface irregularities and achieve good contact without requiring high bonding pressure. The layered structure with appropriate material selection provides the necessary flexibility while maintaining structural integrity for effective heat conduction.
Solution Approach 2:
The patent applies preliminary action by orienting inorganic particles perpendicular to the sheet surface during manufacturing, creating pre-established thermal conduction pathways that remain effective even under reduced bonding pressure. This preliminary structuring ensures good thermal contact is achieved without requiring excessive pressure that could damage the chip.
3Reliability
If inorganic particles are oriented perpendicular to the sheet surface to improve thermal conductivity, then the thermal conduction performance improves, but the manufacturing complexity increases
Solution Approach 1:
The patent applies parameter changes by controlling the orientation of inorganic particles through manufacturing process parameters such as extrusion direction, rolling direction, or magnetic field application during fabrication. By adjusting these parameters, the particles become oriented perpendicular to the sheet surface, enhancing thermal conductivity in the thickness direction while using established manufacturing techniques to manage complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The liquid layer significantly reduces thermal resistance by ensuring close contact despite surface unevenness, maintaining high thermal conductivity and flexibility.
Implementation Method 1
a liquid heat conduction material having a thermal conductivity of 5 W/(m·K) or more, for forming a liquid layer by applying the material to at least a part of a heat conduction layer containing heat conductive particles
Data Source
AI summary
A liquid heat conduction material having a thermal conductivity of 5 W/(m·K) or more, for forming a liquid layer by applying the material to at least a part of a heat conduction layer containing heat conductive particles.