Liquid Immersion Cooling for Computing Modules
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Solution Overview
Problem
Traditional cooled system chassis in information handling systems face challenges with non-uniform cooling and energy efficiency due to inadequate thermal management.
Innovation Solution
A computing module apparatus with a sealed interior volume containing dielectric immersion fluid, mechanical interconnects, and a fluid circulation system for heat transfer, integrated into a rack-mountable tray with thermal pads and fluid circulation lines for efficient cooling of computing components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional air cooling methods are used in system chassis, then the cooling system is simple to implement, but the cooling uniformity and thermal management efficiency deteriorate
Solution Approach 1:
The patent applies liquid immersion cooling where computing components are submerged in a dielectric fluid within a sealed interior volume. The fluid circulation system with cold fluid intake and warm fluid return creates uniform thermal contact with all components, eliminating hot spots and achieving consistent temperature distribution across the computing module.
Solution Approach 2:
The patent changes the cooling medium from gas (air cooling) to liquid (dielectric fluid immersion), fundamentally altering the thermal transfer parameter. This phase change from air cooling to liquid immersion provides superior heat transfer coefficients and uniformity, while the sealed environment maintains the liquid in a stable state.
2Use of energy by moving object
If traditional cooling methods are used, then the system structure is simple, but the energy efficiency deteriorates
Solution Approach 1:
The liquid immersion cooling system replaces energy-inefficient air cooling with hydraulic cooling using dielectric fluid circulation. The fluid directly contacts computing components, providing superior thermal transfer efficiency and reducing the energy required for cooling operations while maintaining a compact sealed structure.
Solution Approach 2:
The sealed interior volume containing the dielectric fluid creates a self-contained cooling system where the fluid continuously circulates through thermal contact with computing components, absorbing heat and transferring it to the cooling infrastructure without requiring external active cooling mechanisms for each component.
3Temperature
If computing components are exposed to the outside environment, then the system is easier to access and maintain, but thermal management efficiency deteriorates
Solution Approach 1:
The patent seals the computing components within an enclosed interior volume filled with dielectric fluid, changing the environmental parameter from open air to controlled liquid immersion. This sealed environment ensures uniform thermal contact with all components while maintaining electrical isolation and consistent temperature distribution.
Solution Approach 2:
The dielectric fluid acts as an intermediary medium between the computing components and the external cooling system. It provides thermal transfer while electrically isolating the components, allowing efficient heat removal without direct exposure of components to the outside environment or cooling infrastructure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides uniform and efficient cooling of computing modules by transferring heat from the components to the fluid circulation system, enhancing thermal management and energy efficiency within the information handling system.
Implementation Method 1
an immersion fluid contained within the interior volume of the computing module and surrounding the computing components
Implementation Method 2
a fluid circulation system positioned within the tray and coupled to each of the thermal pads, the fluid circulation system circulating fluid within the tray and coupled to each of the thermal pads to transfer heat from the computing modules
Data Source
AI summary
A computing module apparatus for use in a rack-mountable tray, the computing module apparatus including: one or more walls defined between a top surface and a bottom surface, wherein the walls, the top surface, and the bottom surface define an interior volume of the computing module; one or more computing components positioned within the interior volume of the computing module; an immersion fluid contained within the interior volume of the computing module and surrounding the computing components; and one or more mechanical interconnects for mechanical coupling the computing module with the rack-mountable tray.