Liquid Immersion Cooling for Electronic Devices
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Solution Overview
Problem
Existing liquid immersion cooling methods require large amounts of coolant and compromise maintainability when multiple electronic devices are immersed, leading to high costs and difficulty in servicing individual devices due to their size and complexity.
Innovation Solution
A system that uses a casing filled with a coolant for components with low calorific values and a water cooling jacket for high calorific components, with a pump and cooling device to efficiently transfer heat, allowing for effective cooling of both types of components with a reduced amount of coolant and maintaining device accessibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple electronic devices are immersed in a liquid coolant, then cooling effectiveness is improved, but maintainability deteriorates due to device accessibility issues
Solution Approach 1:
The electronic device is divided into two segments: high calorific value components (CPU, GPU) that remain outside the coolant, and low calorific value components (memory, storage) that are immersed in the coolant. This segmentation allows the high-calorific components to be easily accessible for maintenance while still achieving effective cooling of all components through the dual-path cooling approach.
2Temperature
If a liquid immersion cooling system is implemented, then cooling performance is improved, but device complexity increases due to the immersion tank and circulation system
Solution Approach 1:
The high calorific value components (CPU, GPU) are extracted from the immersion cooling environment and placed in a separate cooling path using liquid cooling jackets. This extraction simplifies the overall system by eliminating the need for a large immersion tank and complex circulation pumps, while still achieving high cooling performance through direct liquid contact with the hottest components.
3Productivity
If high density mounting of electronic devices is implemented, then productivity is improved, but temperature control deteriorates due to excessive heat generation
Solution Approach 1:
Different cooling methods are applied to different components based on their local heat generation characteristics. High calorific value components (CPU, GPU) receive intensive liquid cooling through jackets, while low calorific value components (memory, storage) are cooled by immersion in coolant. This localized cooling approach enables high-density mounting while maintaining effective temperature control for each component type.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces coolant usage and costs while maintaining device reliability and ease of maintenance by effectively cooling both high and low calorific value components within a compact, standard-sized electronic device, allowing for efficient heat transfer and reduced installation space requirements.
Implementation Method 1
a casing configured to be partly filled with a first coolant and immerse, in the first coolant, a heat generating component other than a first heat generating component
Implementation Method 2
a liquid cooling jacket provided in contact with the first heat generating component placed in the casing, and configured to cool the first heat generating component
Implementation Method 3
a first cooling device configured to dissipate heat of a second coolant sent out from the liquid cooling jacket through a first pipe, thereby cooling the second coolant
Data Source
AI summary
An apparatus for liquid immersion cooling, the apparatus includes: a casing configured to be partly filled with a first coolant and immerse, in the first coolant, a heat generating component other than a first heat generating component in a plurality of heat generating component; a liquid cooling jacket provided in contact with the first heat generating component placed in the casing, and configured to cool the first heat generating component; a first cooling device configured to dissipate heat of a second coolant sent out from the liquid cooling jacket through a first pipe, thereby cooling the second coolant; and a first pump configured to send out the second coolant cooled by the first cooling device to the liquid cooling jacket through a second pipe.