Liquid Interlayer Chip Transfer Method
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Solution Overview
Problem
Current chip transfer technologies face limitations in handling and transferring microelectronic chips due to insufficient resolution for smaller chip dimensions and mechanical strength issues, particularly in collective transfer and individual placement on supports, leading to inefficiencies in production rates and precision.
Innovation Solution
A method involving the formation of a liquid interlayer between the chip and a second support, followed by solidification and detachment, allowing for precise and secure transfer of chips without the need for individual handling tools, enabling both collective and individual chip transfer with improved precision and reduced spacing between chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If collective transfer technology is used to transfer chips, then production rate is improved, but manufacturing precision deteriorates due to insufficient resolution for reduced chip dimensions
Solution Approach 1:
The patent introduces a liquid interlayer as an intermediary substance between the chip and the second support. This liquid layer enables collective transfer of multiple chips while maintaining high precision through capillary forces and controlled solidification, resolving the contradiction between high-speed collective transfer and precise placement for small-dimensional chips
Solution Approach 2:
The patent changes the physical state parameter of the interlayer material from liquid to solid through controlled solidification. This phase transition enables precise chip attachment during collective transfer, allowing high production rates while maintaining manufacturing precision for reduced chip dimensions
2Manufacturing precision
If individual handling tools are used to transfer chips, then manufacturing precision is improved, but productivity deteriorates due to sequential transfer process
Solution Approach 1:
The patent merges multiple individual chip transfer operations into a single collective transfer process. By applying the liquid interlayer method simultaneously to multiple chips on a support, the system achieves both high precision (comparable to individual handling) and high productivity (through parallel processing of multiple chips)
3Area of stationary object
If chips are disposed closely on a support, then area utilization is improved, but device complexity increases due to insufficient mechanical strength for handling
Solution Approach 1:
The patent replaces the mechanical bonding system (which requires thick walls and large spacing for structural strength) with a liquid-solid phase change system. The liquid interlayer provides sufficient attachment strength for closely-spaced chips through capillary forces and controlled solidification, enabling high-density chip arrangement without increasing handling system complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances chip transfer efficiency by providing a strong and precise attachment mechanism that overcomes mechanical bonding limitations, enabling higher production rates and precise placement of chips on supports, even for small dimensions, while allowing for direct gluing and easy removal of the interlayer.
Implementation Method 1
a formation of an interlayer in the liquid state between, and in contact with, a front face of the chip and an assembly surface of a face of the second support, and a solidification of the interlayer
Data Source
AI summary
A method for transferring at least one chip, from a first support to a second support, includes forming, while the chip is assembled to the first support, an interlayer in the liquid state between, and in contact with, a front face of the chip and an assembly surface of a face of the second support and a solidification of the interlayer. Then, the chip is detached from the first support while maintaining the interlayer in the solid state.