Liquid Jet Head Chip Protective Film Masking
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Solution Overview
Problem
The existing methods for manufacturing liquid jet head chips face challenges in efficiently removing protective films like poly-paraxylene from areas that do not require them, leading to potential damage and fluffing issues during the removal process, which complicates the manufacturing process and increases the risk of coupling failures with external boards.
Innovation Solution
A method involving a substrate preparation step and a protective film formation step where the actuator plate substrate is prepared with jet and non-jet channels, and a mask is used to expose only the jet channels during protective film deposition, preventing the film from being applied to non-jet channels and ensuring precise alignment with intermediate plates and coupling areas to avoid fluffing and coupling failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the protective film is removed using oxygen plasma etching process, then the protective film is removed from the part not requiring it, but ozone is generated which may exert an influence on the protective film provided to the necessary part
Solution Approach 1:
The actuator plate is divided into jet channels and non-jet channels, with the protective film selectively applied only to the jet channels through masking during the deposition process. This segmentation eliminates the need for post-deposition removal operations, avoiding ozone exposure risks while maintaining manufacturing efficiency.
Solution Approach 2:
The masking step is performed before the protective film deposition, preliminarily defining the areas that should and should not receive the protective film. This preliminary action prevents the need for subsequent removal operations, thereby eliminating ozone generation risks while ensuring the protective film is applied only where needed.
2Ease of manufacture
If the masking member is removed using a physical method after forming the protective film, then the masking member is removed, but the protective film may be broken to cause fluffing
Solution Approach 1:
The masking step is performed before the protective film deposition, preliminarily defining the areas that should and should not receive the protective film. This preliminary action prevents the need for subsequent removal operations that could cause fluffing, thereby maintaining protective film integrity while achieving the desired selective coverage.
3Reliability
If the protective film is provided to the part not requiring the protective film, then the protective film ensures durability, but the trouble of removing the protective film from the part not requiring it increases
Solution Approach 1:
The masking step is performed before the protective film deposition, preliminarily defining the areas that should and should not receive the protective film. This preliminary action ensures the protective film is applied only where needed, eliminating subsequent removal steps and reducing manufacturing process complexity while maintaining durability where required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the removal of protective films from non-requiring areas, prevents fluffing, and reduces the risk of coupling failures with external boards, thereby streamlining the manufacturing process and enhancing the reliability of liquid jet head chips.
Implementation Method 1
The poly-paraxylene film has an advantage of adhering to a complicated structure
Data Source
AI summary
The trouble of removing a protective film such as a poly-paraxylene film from the part not requiring the protective film is reduced. A method of manufacturing a head chip according to an aspect of the present disclosure includes a substrate preparation step of preparing an actuator plate substrate having a jet channel communicated with a nozzle hole configured to jet ink, and a non-jet channel which does not jet the ink, and a protective film formation step of forming a protective film configured to protect a common electrode formed on an inner surface of the jet channel from the ink in a state in which the jet channel is exposed and the non-jet channel is covered after the substrate preparation step.