Liquid Jet Head Driver IC Assembly Protection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing liquid discharge head designs face difficulties in assembling the casing without damaging the driver IC, as the side plate of the casing can rub against it during attachment, leading to potential damage.
Innovation Solution
The design incorporates an elastic plate to push the driver IC onto the casing, ensuring it is positioned to avoid direct contact with the inner surfaces during assembly, and the casing is inclined to reduce the risk of damage, with a buffer material used to further protect the IC during assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the casing is attached to the head main body with the driver IC mounted on the flexible substrate, then the driver IC can be positioned for heat dissipation and electrical connection, but the side plate of the casing rubs against the driver IC during assembly causing damage risk
Solution Approach 1:
The driver IC is mounted on the flexible substrate before attaching the casing to the head main body. This preliminary mounting allows the driver IC to be positioned in advance, and the casing is then attached in a manner that avoids rubbing against the already-positioned driver IC, thereby preventing damage during assembly
Solution Approach 2:
The flexible substrate serves as an intermediary between the driver IC and the casing. By mounting the driver IC on the flexible substrate rather than directly on the casing, the substrate provides a buffer and positioning layer that prevents direct contact and rubbing between the casing side plate and the driver IC during assembly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the likelihood of the driver IC being damaged during assembly by minimizing contact with the casing's inner surfaces, enhancing the assembly process and maintaining the IC's integrity.
Implementation Method 1
piezoelectric actuator substrates having a plurality of displacement elements which is provided to respectively cover the liquid pressurization chambers
Implementation Method 2
The driver IC is in contact with an inner surface of an oblong casing of the liquid discharge head, and heat of the driver IC is removed through the casing
Data Source
Figure 1
Figure 2
Figure 3
AI summary
An object of the present invention is to provide a liquid discharge head in which a driver IC is not easily damaged at the time of assembling, and a recording device using the same. A liquid discharge head 2 of the present invention is the liquid discharge head 2 including a head main body 2a, a casing 90, and a driver IC 55 that drives the head main body 2a. The casing 90 has an opening 90aa and is in contact with the head main body 2a at the opening 90aa so as to cover at least a part of the head main body 2a, a part of an inner surface of a side plate 90b of the casing 99a continuing from the opening 90aa has an inclination portion inclined toward the inner side of the casing 90 with respect to the opening 90aa, and the driver IC 55 is in contact with the inclination portion of the inner surface.