Liquid Jet Head Grounding Alignment for Sliding Load Reduction

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Solution Overview

Problem

In liquid jet devices, the removal of the head body from the mounting hole often results in undesirable sliding contact loads due to the interaction with the grounding portion, leading to potential damage and misalignment during replacement.

Innovation Solution

The design includes a grounding portion that contacts a first side surface of the head body in the removal direction, with the contact position overlapping the position of the first pin in the normal direction, reducing sliding contact loads by allowing smoother rotation and alignment during removal and mounting.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the grounding portion contacts the head body at a position away from the pin location, then the grounding function is achieved, but sliding contact loads occur during removal causing damage and misalignment

Engineering Contradiction:
Improvegrounding functionVSAvoidsliding contact load
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The grounding portion is positioned to contact the head body at a location that overlaps with the pin position in the normal direction of the side surface. This alignment ensures that during removal, the head body rotates about the pin without creating sliding contact at the grounding interface, eliminating the harmful sliding load while maintaining grounding functionality.

Inventive Principle:
Principle #12Equipotentiality

2Ease of operation

If the head body is removed by shaking and rotating about the pin, then removal from mounting hole is achieved, but sliding contact load occurs at grounding portion contact point

Engineering Contradiction:
Improveremoval operationVSAvoidcontact portion integrity
Core Design Contradiction:
Ease of operationVSStrength

Solution Approach 1:

By aligning the grounding portion contact position with the pin position in the normal direction of the side surface, the invention ensures that rotation about the pin during removal does not generate sliding contact at the grounding interface. This eliminates the harmful effect on contact portion integrity while preserving the ease of removal operation.

Inventive Principle:
Principle #12Equipotentiality

3Object-affected harmful factors

If the grounding portion is positioned to overlap with pin position, then sliding contact load is reduced, but grounding contact stability may be affected

Engineering Contradiction:
Improvesliding contact loadVSAvoidgrounding contact stability
Core Design Contradiction:
Object-affected harmful factorsVSStability of the object's composition

Solution Approach 1:

The grounding portion contacts the head body at a position that overlaps with the pin position in the normal direction of the side surface. During removal, the head body rotates about the pin, and since the grounding contact point is aligned with the rotation axis, no sliding contact occurs. This maintains both low sliding contact load and stable grounding contact throughout the removal operation.

Inventive Principle:
Principle #12Equipotentiality

Data Source

PatentUS11518167B2Liquid jet device, head body, and method of mounting head body
Publication Date: 2022.12.06 SEIKO EPSON CORP
  • US11518167B2 patent drawing
  • US11518167B2 patent drawing
  • US11518167B2 patent drawing

AI summary

A liquid jet device includes a head body configured to jet droplets from a nozzle, a frame at which the head body is positioned, a grounding portion configured to contact a first side surface of the head body in a removal direction from the frame to electrically couple the head body to the frame, and a first pin serving as a pin for positioning the head body with respect to the frame, wherein a contact position between the first side surface and the grounding portion and a position of the first pin overlap in a normal direction of the first side surface.