Liquid Jet Head Resin Layer Ink Permeation Resistance
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Solution Overview
Problem
Conventional liquid jet heads face challenges with adhesive degradation due to ink exposure, particularly with water-based and oil-based inks that exhibit high permeability, leading to bonding strength loss and reliability issues.
Innovation Solution
A liquid jet head featuring a resin layer composed of a cured product containing an epoxy compound, a polythiol compound with multiple thiol groups, and an imidazole compound, which provides high organic solvent resistance and is curable at low temperatures, ensuring excellent initial bondability and bonding reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional adhesives are used for bonding members in liquid jet heads, then initial bonding strength can be achieved, but bonding reliability deteriorates due to ink permeation and adhesive degradation
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive by specifying an epoxy compound with particular structural features (formula 1 with specific R1, R2, R3, R4, m, L values) and combining it with a polythiol compound and imidazole compound. This parameter change in adhesive composition provides resistance to ink permeation while maintaining bonding strength, resolving the contradiction between initial strength and long-term reliability.
Solution Approach 2:
The patent creates a composite adhesive system by combining multiple components: an epoxy compound (as base resin), a polythiol compound (as crosslinking agent), and an imidazole compound (as catalyst). This composite material approach provides synergistic effects where the combination delivers both strong initial bonding and high resistance to ink degradation, overcoming the limitations of single-component adhesives.
2Reliability
If adhesives with high ink resistance are selected, then bonding reliability improves, but initial bondability deteriorates due to lack of adhesion to bonding surfaces
Solution Approach 1:
The patent adjusts the chemical parameters of the epoxy compound (specifically the values of R1, R2, R3, R4, m, and L in formula 1) to optimize the balance between adhesion and ink resistance. These parameter changes enable the adhesive to wet and bond to surfaces effectively while maintaining resistance to ink permeation, thus achieving both good initial bondability and long-term reliability.
Solution Approach 2:
The adhesive composition is designed to exhibit different properties at different stages: initially, it provides strong adhesion to bonding surfaces through the epoxy compound's reactivity, and after curing, it provides high ink resistance through the crosslinked network structure formed by the polythiol and imidazole components. This local quality differentiation in time resolves the contradiction between initial bondability and long-term reliability.
3Reliability
If high crosslink density is achieved for ink resistance, then organic solvent resistance improves, but curing temperature increases making low-temperature curing difficult
Solution Approach 1:
The patent changes the chemical parameters by selecting specific functional groups in the epoxy compound (formula 1 with particular R1, R2, R3, R4, m, L values) that enable low-temperature curing. The combination with polythiol compound and imidazole compound creates a curing system that achieves high crosslink density at lower temperatures, providing both organic solvent resistance and low-temperature curability.
Solution Approach 2:
The patent replaces thermal energy input (high temperature curing) with chemical energy input through the imidazole-catalyzed reaction between epoxy and polythiol compounds. This substitution allows the curing process to proceed at lower temperatures while still achieving high crosslink density and organic solvent resistance, resolving the contradiction between curing temperature and solvent resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances the bonding strength and resistance of the resin layer to organic solvents, maintaining reliability even under exposure to challenging ink types, thereby improving the durability and performance of the liquid jet head.
Implementation Method 1
a cured product of a resin composition containing: an epoxy compound represented by general formula (1) below; a polythiol compound having 2 or more thiol groups in a molecule thereof
Implementation Method 2
an imidazole compound represented by general formula (2) below
Data Source
Figure 1~3
Figure 4~5-A
Figure 5-B~6
AI summary
Provided is a liquid jet head, including a flow path including a first member, a resin layer, and a second member, wherein the resin layer contains a cured product of a resin composition containing an epoxy compound represented by General Formula (1), a polythiol compound having 2 or more thiol groups in a molecule thereof, and a specific imidazole compound, where in General Formula (1), L is an integer of 0 or greater but less than 3, m is a positive number of 0.1 or greater but less than 50, R1 represents any one of a hydrogen atom, and an alkyl group having 1 to 4 carbon atoms, and R2 represents a substituent represented by a formula below where R3 and R4 each represent any one of hydrogen atom, and a non-substituted or fluorine-substituted methyl group, and n is an integer of 4 to 12.