Liquid Jet Head Step Portion Sealing Injection
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Solution Overview
Problem
The challenge in downsizing liquid discharge heads is exacerbated by the difficulty in injecting a sealing member between the side end surfaces of the wiring and recording element substrates due to reduced device hole sizes, leading to increased takt time and limited viscosity options for the sealing member when using thinner needles.
Innovation Solution
A liquid discharge head design featuring a step portion on the wiring substrate allows for easier injection of a sealing member by creating a larger distance between the second step portion and the recording element substrate, enabling the use of a thicker needle for efficient sealing while maintaining a compact size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the device hole size is reduced to downsize the wiring substrate, then the size of the liquid discharge head is reduced, but it becomes impossible to insert the needle for injecting the sealing member between the side end surfaces
Solution Approach 1:
The invention introduces a third dimension (depth/layering) by forming a groove that extends from the surface toward the interior of the wiring substrate. This allows the sealing member injection process to occur at a different depth level, creating sufficient space for needle insertion while maintaining a compact overall device size. The groove structure transforms the two-dimensional surface constraint into a three-dimensional solution space.
Solution Approach 2:
The wiring substrate is segmented by creating a groove that divides the substrate into distinct regions: a first region above the groove and a second region below the groove. This segmentation creates a dedicated injection path through the groove, allowing the sealing member to be injected without requiring lateral space that would increase the device footprint.
2Ease of operation
If a thinner needle is used to inject the sealing member through the reduced gap, then the needle can be inserted into the sealing area, but the amount of sealing member injected per time reduces and takt time increases
Solution Approach 1:
By creating a groove that extends into the substrate, the invention provides a vertical injection path that accommodates thicker needles. The groove depth allows sufficient clearance for needle insertion while maintaining a compact lateral footprint, enabling the use of larger bore needles that can inject sealing member at higher rates without increasing device dimensions.
3Ease of operation
If a thinner needle is used to inject the sealing member, then the needle can fit in the reduced gap, but it becomes difficult to apply sealing member having high viscosity
Solution Approach 1:
The groove structure creates a vertical injection channel that accommodates thicker needles with larger internal diameters. This allows high-viscosity sealing members to be injected effectively, as the larger needle bore reduces flow resistance. The groove depth provides the necessary clearance for these thicker needles while maintaining a compact lateral device profile.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design facilitates faster and more effective sealing, reducing production time and expanding viscosity options for the sealing member, thus addressing the limitations of downsizing and cost-cutting in liquid discharge heads.
Implementation Method 1
injecting a thermosetting sealing member in a liquid state between the side end surface of the wiring substrate and the side end surface of the recording element substrate inside the device hole and thermally curing the sealing member
Data Source
AI summary
A liquid discharge head includes a recording element substrate including an energy generating element, a wiring substrate including wiring, a support substrate for supporting the recording element substrate and the wiring substrate so that a side end portion of the recording element substrate and a side end portion of the wiring substrate are adjacent to each other, and a sealing member, wherein the side end portion of the wiring substrate has a step portion, a distance between a second portion of the step portion on the side opposite to the support substrate and the side end portion of the recording element substrate is larger than a distance between a first portion of the step portion on the side of the support substrate and the side end portion of the recording element substrate, and a part of the wiring is formed in the first portion.