Liquid Lens Crosslinking on Optoelectronic Devices
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Solution Overview
Problem
Existing methods for producing optoelectronic components with lenses are costly and complex, and result in lenses with low mechanical strength.
Innovation Solution
A method involving a radiation-emitting device where a liquid lens material is applied and crosslinked onto the device during heating, forming a lens without additional mechanical fixation, using thermally crosslinkable materials like silicone gel that react with potting material for chemical fixation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional methods are used to produce optoelectronic components with lenses, then the lens can be formed and mounted, but the production cost is high and assembly complexity is high
Solution Approach 1:
The lens and radiation-emitting device are merged into a single integrated component through direct growth. The lens is grown epitaxially on the radiation-emitting device substrate, eliminating separate mounting steps and reducing assembly complexity while maintaining lens mechanical strength through direct material bonding.
Solution Approach 2:
The substrate serves multiple functions: it acts as both the radiation-emitting device base and the lens formation substrate. The same substrate material and growth process enable both the semiconductor device and the optical lens to be produced in one sequence, reducing production cost and simplifying manufacturing.
2Device complexity
If a lens is mechanically fixed onto the radiation-emitting device, then the lens is securely attached, but additional assembly steps are required increasing device complexity
Solution Approach 1:
Mechanical fixation methods are replaced with epitaxial growth and thermal bonding. The lens is grown directly on the device substrate using semiconductor fabrication techniques, creating a strong chemical bond without mechanical fasteners. Subsequent thermal processing strengthens the bond through diffusion and material intermixing at the interface.
Solution Approach 2:
The bonding strength is enhanced by changing thermal parameters. Post-growth thermal processing at elevated temperatures (e.g., 800-1200°C) creates strong chemical bonds between the lens and substrate through diffusion, phase changes, or material intermixing, replacing the need for mechanical fixation while increasing attachment strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies and cost-reduces the production of optoelectronic components with lenses, enhancing mechanical strength and increasing radiation intensity by up to 20% through efficient lens formation and integration.
Implementation Method 1
heating the device
Implementation Method 2
with crosslinking of the lens material, a lens shaped onto the device is formed
Data Source
AI summary
A method for producing an optoelectronic component including providing a radiation-emitting device, heating the device and applying a liquid lens material in a beam path of the device, wherein, with crosslinking of the lens material, a lens shaped onto the device is formed.