Liquid Loop Cooling Apparatus Piping Arrangement
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Solution Overview
Problem
The increasing heat generation in electronic components, such as CPUs, poses a challenge for maintaining stable operation as existing cooling solutions fail to efficiently manage heat dissipation, leading to potential malfunctions and reduced processing power.
Innovation Solution
A liquid loop cooling apparatus is designed with an evaporator thermally coupled to the electronic component, a condenser cooled by airflow, and a pump circulating a refrigerant through a specific piping arrangement that optimizes refrigerant flow and heat transfer, using reduced pressure and materials like copper or stainless steel to minimize size and energy consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional cooling solutions are used, then the cooling system can operate, but the heat dissipation efficiency is insufficient leading to potential malfunctions and reduced processing power
Solution Approach 1:
The patent employs phase transition of refrigerant in the evaporator, where the refrigerant absorbs heat from the electronic component by transitioning from liquid to vapor state, enabling efficient heat removal and maintaining operational stability under high heat generation conditions
Solution Approach 2:
The patent utilizes a closed-loop liquid cooling system with pump-driven refrigerant circulation through evaporator and condenser components, replacing traditional air cooling with hydraulic-based heat transfer to improve heat dissipation efficiency and reliability
2Use of energy by moving object
If cooling system size is reduced, then energy consumption decreases, but cooling capacity may be compromised
Solution Approach 1:
The patent optimizes system parameters including refrigerant flow rate, evaporator temperature, and condenser pressure to maximize cooling capacity per unit energy consumed, enabling reduced system size while maintaining effective cooling performance through enhanced heat transfer coefficients and optimized thermal cycles
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively maintains electronic component temperatures within safe limits, enhancing operational stability and reducing the size and energy usage of cooling systems by increasing flow rate and cooling capacity by 8% and 11% respectively compared to traditional designs.
Implementation Method 1
an evaporator thermally coupled to a heating element
Implementation Method 2
an evaporator thermally coupled to a heating element
Implementation Method 3
the first piping is arranged on a destination side of the airflow, and the second piping is arranged on a source side of the airflow
Implementation Method 4
a condenser configured to be cooled by an airflow
Implementation Method 5
a pump configured to circulate a refrigerant between the evaporator and the condenser
Data Source
AI summary
A liquid loop cooling apparatus includes: an evaporator thermally coupled to a heating element; a condenser configured to be cooled by an airflow; a pump configured to circulate a refrigerant between the evaporator and the condenser; a first piping configured to couple the evaporator and the condenser; a second piping configured to couple the condenser and the pump; and a third piping configured to couple the pump and the evaporator, wherein the first piping is arranged on a destination side of the airflow, and the second piping is arranged on a source side of the airflow.