Liquid Low Temperature Oxide for Extreme Environment Structures
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Solution Overview
Problem
Existing oxide materials for complex structures fail to simultaneously provide sufficient strength, operational viability in extreme environments, and cost-effective low-temperature manufacturing, with most coatings or 3D printing techniques either being too thin or unsuitable for high-temperature or oxidizing conditions.
Innovation Solution
A liquid low-temperature oxide (LLTO) material is developed by dissolving fumed nanoparticles in a silicate or aluminate liquid hydrate, allowing for adjustable viscosity and curing rate, enabling application through various techniques such as drop casting, spin coating, and 3D printing, and forming structural silicate glass at low temperatures suitable for extreme environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional coatings (Spin-On Glass, FOX Flowable Oxides) are used for low-temperature processing, then the process temperature is reduced and extreme environment operability is improved, but the coating thickness is insufficient to provide adequate structural strength
Solution Approach 1:
The patent changes the chemical composition parameters of the oxide material by incorporating specific metal oxides (aluminum oxide, titanium oxide, zirconium oxide) in controlled ratios to achieve a material that cures at low temperatures while maintaining high structural strength. The refractive index and composition ratios are adjusted to optimize both low-temperature processing and post-cure strength properties
Solution Approach 2:
The patent creates a composite oxide material combining multiple metal oxides (silica, aluminum oxide, titanium oxide, zirconium oxide) to achieve synergistic effects. This composite structure provides both the low-temperature curability needed for semiconductor processing and the high strength required for structural applications in extreme environments
2Strength
If additive 3D printing techniques (binder jetting, stereolithography) are used to provide sufficient structure, then structural strength is improved, but the process temperature becomes too high for certain fabrication settings
Solution Approach 1:
The patent modifies the material composition to enable curing at temperatures below 200°C, which is suitable for temperature-sensitive semiconductor substrates. The oxide blend and catalyst system are specifically designed to achieve complete curing at these low temperatures, eliminating the need for high-temperature post-processing steps
3Temperature
If structural surface treatments (Kapton polyimide, ACCUGLASS, SU-8) are used for low-temperature processing, then process temperature is reduced, but the materials are not suitable for high temperature or oxidizing environments
Solution Approach 1:
The patent formulates a composite oxide material containing aluminum oxide, titanium oxide, and zirconium oxide that provides both low-temperature curability and high-temperature stability. This composite structure maintains mechanical and chemical integrity in oxidizing environments at temperatures up to 400-500°C, unlike organic-based alternatives
4Reliability
If existing oxide coatings are applied to achieve extreme environment operability, then reliability in harsh environments is improved, but the coating thickness remains too thin for structural applications
Solution Approach 1:
The patent adjusts the oxide composition ratios and curing parameters to enable the formation of thick coatings (tens to hundreds of micrometers) that maintain structural integrity. The material formulation allows for controlled thick-film deposition without compromising the extreme environment operability or creating internal stresses that would cause cracking
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The LLTO material provides robust, extreme environment-compatible structures with tunable viscosity and curing rates, suitable for microfabrication, 3D printing, and semiconductor wafer fabrication, addressing the limitations of existing technologies by offering a strong, cost-effective solution for harsh environments.
Implementation Method 1
curing the liquid oxide material to evolve gaseous water, leaving structural silicate glass
Data Source
AI summary
In some embodiments, a method of forming a structure includes: forming a liquid oxide material at a low temperature by dissolving fumed nanoparticles in a liquid hydrate of a silicate or an aluminate; applying the liquid oxide material on a substrate; and at a low temperature, curing the liquid oxide material to evolve gaseous water, leaving structural silicate glass.