Liquid-Mediated Direct Bonding for Semiconductor Chips
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Solution Overview
Problem
Current direct bonding methods for semiconductor devices are complex and laborious due to the need for vacuum or inert gas environments to prevent oxidation and ensure accurate alignment, and they require thorough surface cleaning, which complicates the mounting process and increases apparatus size and complexity.
Innovation Solution
A semiconductor device manufacturing method and apparatus that involves placing the bonding target in a liquid vessel, allowing for easy removal of foreign substances and accurate positioning, and using a bonding head to directly bond the chip component to the bonding target in the liquid, which can include an etching solution to generate active layers or prevent oxidation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a vacuum or inert gas environment is used to prevent oxidation during direct bonding, then oxidation prevention is improved, but apparatus size and complexity increase
Solution Approach 1:
The patent introduces liquid as an intermediary medium that performs multiple functions: it prevents oxidation of electrode parts during bonding, enables easy removal of foreign substances through dissolution, and allows positioning detection before injection. This single intermediary replaces the need for complex vacuum or inert gas systems, directly resolving the contradiction between oxidation prevention and apparatus complexity.
2Reliability
If the bonding head and stage are accommodated in a chamber for vacuum or inert gas, then oxidation prevention is improved, but apparatus size increases
Solution Approach 1:
The liquid medium serves as a compact alternative to large vacuum chambers or inert gas systems. By immersing the bonding interface in liquid, oxidation prevention is achieved without requiring a sealed chamber environment, significantly reducing the apparatus volume while maintaining reliability.
3Manufacturing precision
If thorough surface cleaning is performed prior to direct bonding, then bonding accuracy is improved, but the process becomes more laborious
Solution Approach 1:
The patent performs cleaning action preliminarily and continuously by immersing components in liquid before and during positioning. Foreign substances are dissolved in advance, eliminating the need for separate, laborious cleaning steps while ensuring high bonding accuracy. The liquid medium prepares the surfaces automatically as part of the bonding process.
4Object-affected harmful factors
If positioning is performed in liquid, then foreign substance removal is improved, but positioning accuracy may be affected by liquid interference
Solution Approach 1:
The patent performs positioning detection before injecting the liquid medium. This preliminary positioning action occurs in air where measurement is straightforward and accurate. After positioning is established, liquid is injected to provide the cleaning and oxidation prevention benefits, thus combining the advantages of both dry positioning accuracy and wet cleaning effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the bonding process, improves accuracy, and reduces the complexity and size of the apparatus, while effectively preventing oxidation and allowing for efficient cleaning, resulting in a more straightforward and effective direct bonding method.
Implementation Method 1
The liquid may be an etching solution for etching a bonding surface of the electrode part or a bonding surface of the bonding part to generate an active layer on the bonding surface of the electrode part or the bonding surface of the bonding part
Implementation Method 2
to prevent oxidation of electrode parts, a bonding head and a stage on which a substrate is placed are accommodated in a chamber, and the inside of the chamber is made a vacuum or filled with inert gas
Data Source
AI summary
Provided is a bonding method for directly bonding an electrode part of a chip component to a bonding part provided on a substrate that is a bonding target, the method comprising: a step for placing the substrate on a stage inside a liquid vessel; a step for injecting liquid into the liquid vessel; and a step for bonding the electrode part of the chip component to the bonding part (electrode part) of the bonding target by superimposing the chip component held by a bonding head in the liquid stored in the liquid vessel over the bonding target and then applying pressure thereto.