Liquid Metal Anisotropic Conductive Film for Low-Temperature Flexible Bonding
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Solution Overview
Problem
Conventional anisotropic conductive materials like soldering and conductive paste are inflexible and require high temperatures, making them unsuitable for flexible printed circuit boards and fine spacing applications.
Innovation Solution
An anisotropic conductive film using microencapsulated liquid metal and a low-temperature adhesive material, such as gelatin-based hydrogel, allows for flexible bonding at low temperatures and maintains conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional anisotropic conductive materials (soldering, conductive paste) are used, then electrical conductivity is achieved, but flexibility and stretchability are lost
Solution Approach 1:
The patent changes the physical state of the conductive material from solid (conductive paste) to liquid (microencapsulated liquid metal). This parameter change enables the material to flow and conform to flexible substrates while maintaining electrical conductivity, resolving the contradiction between conductivity and flexibility
Solution Approach 2:
The patent creates a composite structure by encapsulating liquid metal cores within polymer shell matrices. This composite approach combines the electrical conductivity of liquid metal with the flexibility and mechanical strength of the polymer matrix, achieving both conductivity and flexibility simultaneously
2Strength
If high temperature bonding process is used, then strong adhesion is achieved, but thermal damage to flexible substrates occurs
Solution Approach 1:
The patent replaces the thermal bonding mechanism with a mechanical bonding mechanism. The microencapsulated liquid metal particles form mechanical interlocks and adhesive bonds at room temperature or low temperatures, eliminating the need for high temperature processing that would damage flexible substrates
Solution Approach 2:
The patent changes the bonding temperature parameter from high temperature (conventional soldering) to room temperature or low temperature. This parameter change enables bonding of flexible substrates without thermal damage while maintaining adhesion strength through the unique properties of liquid metal particles
3Reliability
If non-stretchable materials are used for wiring, then electrical connection is achieved, but mechanical deformation resistance is poor
Solution Approach 1:
The patent changes the mechanical state of the conductive material from rigid (solid solder or paste) to fluid (liquid metal). This parameter change enables the material to stretch and deform with the flexible substrate while maintaining electrical connectivity, achieving both joint reliability and stretchability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables flexible wiring connections at low temperatures, suitable for flexible printed circuit boards and fine spacing, with improved stretchability and conductivity.
Implementation Method 1
The anisotropic conductive film includes a binder layer containing a conductive microcapsule
Implementation Method 2
The binder layer may include a low-temperature adhesive material having a self-healing ability
Implementation Method 3
The conductive microcapsule includes a liquid metal. The liquid metal may include gallium (Ga) or a gallium-based alloy
Data Source
AI summary
The present disclosure relates to an anisotropic conductive film capable of electrode bonding even at a low temperature and maintaining excellent conductivity and flexibility, a manufacturing method thereof, and a display device using the same. The anisotropic conductive film contains conductive microcapsules including a liquid metal in a binder layer.