Liquid Metal Connector Interface for Stable Low-Resistance Contact
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing probe cards have a small contact area between connectors and electrodes, leading to high contact resistance and instability in electrical connections.
Innovation Solution
The electrical connecting apparatus features a configuration where liquid metal is filled in recessed parts of the electrode regions on both wiring substrates, with a connector making contact with the liquid metal at both ends, thereby expanding the contact area and reducing resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If connectors with conical tips are used to connect wiring substrate and probe substrate, then the device complexity is reduced, but the contact area between connector and electrodes becomes small, leading to large contact resistance
Solution Approach 1:
Liquid metal is introduced as an intermediary substance between the connector and the electrodes. The liquid metal fills the recessed parts on both the wiring substrate and probe substrate, creating a mediating contact layer that expands the effective contact area and reduces contact resistance while maintaining structural simplicity
Solution Approach 2:
The physical state of the contact interface is changed from solid-to-solid contact to solid-to-liquid contact. By using liquid metal instead of traditional solid contact, the contact area is dynamically expanded and contact resistance is reduced, improving electrical connecting reliability
2Reliability
If liquid metal is used to expand contact area, then contact resistance is reduced, but the device complexity increases due to additional recessed parts and liquid metal filling structure
Solution Approach 1:
The recessed parts are integrated directly into the substrate structures of the wiring substrate and probe substrate. The liquid metal filling structure is combined with the existing substrate design, merging multiple functions into unified components rather than adding separate complex assemblies
Solution Approach 2:
The liquid metal is selectively applied only in the recessed contact regions where electrical connection is needed, rather than throughout the entire device. This localized application expands contact area precisely where required while minimizing overall structural complexity
3Stability of the object's composition
If probe substrate flatness is adjusted to retain stable contact property, then contact stability is improved, but the positions of upper electrode and lower electrode in height direction become dispersed
Solution Approach 1:
The rigid flatness requirement is transformed into a flexible liquid metal adaptation. Instead of forcing precise flat positioning, the liquid metal conforms to the actual contact surfaces, changing the contact parameter from geometry-dependent to material-property-dependent
Solution Approach 2:
The static flatness adjustment is replaced with dynamic liquid metal adaptation. The liquid metal can flow and conform to the actual contact interface, providing stable electrical connection that adapts to position variations rather than requiring precise fixed positioning
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution stabilizes the electrical connecting property by expanding the contact area between the electrode regions and the connector, effectively suppressing contact resistance.
Implementation Method 1
a first electrode region in which a liquid metal is filled in a first recessed part that is capable of conducting with a substrate electrode of a first wiring substrate
Data Source
AI summary
An electrical connecting apparatus according to the present disclosure is characterized in including a first electrode region in which a liquid metal is filled in a first recessed part that is capable of conducting with a substrate electrode of a first wiring substrate, a second electrode region in which a liquid metal is filled in a second recessed part that is capable of conducting with a substrate electrode of a second wiring substrate opposing the first wiring substrate in a vertical direction, and a connector that causes conduction between the first electrode region and the second electrode region by bringing one end part into contact with the liquid metal of the first electrode region and bringing the other end part into contact with the liquid metal of the second electrode region.