Liquid Metal Heat Dissipation Structure for Corrosion Isolation
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Solution Overview
Problem
Existing heat dissipation structures using liquid metals for electronic devices face corrosion issues with materials like aluminum and the formation of intermetallic compounds with copper, leading to reduced thermal conductivity and risk of short circuits when in contact with electronic components or substrates.
Innovation Solution
An electronic device with a heat dissipation structure that includes a heat dissipation unit with an anti-corrosion layer, a liquid metal layer, a blocking member, fixing adhesive, insulation layer, and cushioning adhesive, which prevents direct contact between the liquid metal and heat dissipation body, and blocks the liquid metal from reaching electronic components or substrates, thereby preventing corrosion and short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If aluminum is used as heat dissipation body material, then thermal conductivity is improved, but corrosion resistance deteriorates due to gallium attack
Solution Approach 1:
A blocking member (13) made of corrosion-resistant material is introduced as an intermediary between the liquid metal layer (11) and the heat dissipation body (121). This blocking member prevents direct contact between gallium-containing liquid metal and aluminum, eliminating corrosion while maintaining thermal conductivity through the liquid metal path.
Solution Approach 2:
The heat dissipation structure is segmented into distinct functional layers: the heat dissipation body (121), the liquid metal layer (11), and the blocking member (13). This segmentation allows each component to perform its specific function - heat dissipation, thermal conduction, and corrosion protection - without interfering with the others.
2Object-affected harmful factors
If copper is used as heat dissipation body material, then corrosion resistance is improved, but intermetallic compound formation worsens leading to liquid metal dry-out
Solution Approach 1:
The blocking member (13) serves as a physical barrier that prevents copper in the heat dissipation body from directly reacting with gallium in the liquid metal layer. This eliminates intermetallic compound formation and maintains liquid metal fluidity and thermal conductivity over time.
3Reliability
If liquid metal is allowed to contact electronic components or substrate, then heat dissipation efficiency is improved, but short circuit risk worsens
Solution Approach 1:
The blocking member (13) acts as an electrical insulator that prevents liquid metal from contacting the substrate and electronic components, eliminating short circuit risk while allowing thermal energy to be dissipated effectively through the designed heat dissipation paths.
Solution Approach 2:
The blocking member is strategically positioned only where electrical contact would be harmful, allowing liquid metal to maintain thermal contact with the heat dissipation body while being electrically isolated from conductive substrates and components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents corrosion and maintains thermal conductivity by isolating the liquid metal from the heat dissipation body and electronic components, ensuring stable and durable heat dissipation while avoiding short circuits and component damage.
Implementation Method 1
Liquid metals have high stability and exceptional thermal and electrical conductivity. Moreover, the specific heat capacity and thermal conductivity of the liquid metals are much higher than those of the traditional silicone conductive pastes, so that they are now used as a thermal conductive agent between a heat source and heat-dissipating fins.
Implementation Method 2
Aluminum or copper is often used as the main material for heat-dissipating fins. However, aluminum is easily corroded by gallium in the liquid metal, resulting in the damage of the heat-dissipating fins and losing the thermal conductivity of the liquid metal.
Data Source
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AI summary
An electronic device (3) includes a heat-generating structure (2) and a heat dissipation structure (1). The heat-generating structure (2) includes a substrate (21), an electronic component (22) disposed on the substrate (21), and at least one electronic element (23) disposed on the substrate (21) and spaced apart from electronic component (22). The heat dissipation structure (1) includes a heat dissipation body (121), an anti-corrosion layer (122) formed on the heat dissipation body (121), a liquid metal layer (11) disposed between electronic component (22) and the heat dissipation body (121), a blocking member (13) disposed between the substrate (21) and the anti-corrosion layer (122), a fixing adhesive (15) located between the electronic component (22) and the blocking member (13), an insulation layer (14) disposed between the substrate (21) and the anti-corrosion layer (122), and a cushioning adhesive (16) disposed between the blocking member (13) and the anti-corrosion layer (122).