Liquid Metal Cover Structure for Semiconductor Heat Dissipation

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Solution Overview

Problem

Conventional semiconductor devices face challenges in effectively dissipating heat generated by electronic components, which can lead to performance degradation and reliability issues.

Innovation Solution

A semiconductor device design that incorporates a substrate, an electronic component, a cover with a recess, and liquid metal, where the liquid metal is formed between the recess and the electronic component to facilitate heat dissipation, utilizing a cover made of conductive materials like copper or aluminum to enhance thermal conductivity and structural integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional semiconductor device structure is used, then device simplicity is maintained, but heat dissipation capability is insufficient

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoiddevice structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The liquid metal layer is nested within the recess formed in the cover, creating a compact heat dissipation structure that integrates seamlessly into the existing device architecture without requiring external components

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The invention combines liquid metal (high thermal conductivity material) with the solid cover structure to create a composite heat dissipation system that leverages the superior thermal properties of liquid metal while maintaining structural integrity

Inventive Principle:

Principle #40Composite materials

2Temperature

If liquid metal is added to improve heat dissipation, then thermal management is enhanced, but manufacturing complexity increases

Engineering Contradiction:

Improvethermal managementVSAvoidmanufacturing process complexity

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The recess is pre-formed in the cover before the liquid metal is introduced, ensuring proper positioning and containment of the liquid metal without requiring complex assembly steps or specialized equipment

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The liquid metal is introduced into the recess through capillary action or pressure-driven flow, eliminating the need for complex dispensing equipment or precise positioning mechanisms

Inventive Principle:

Principle #29Pneumatics and hydraulics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively dissipates heat through the liquid metal and cover, improving the thermal management of semiconductor devices and reducing the risk of warpage, while maintaining electrical connectivity and structural integrity.

Implementation Method 1

The liquid metal is formed between the recess and the electronic component... effectively dissipates heat through the liquid metal and cover

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20240170360A1Semiconductor device and manufacturing method thereof

Publication Date: 2024.05.23 MEDIATEK INC

AI summary

A semiconductor device includes a substrate, an electronic component, a cover and a liquid metal. The electronic component is disposed on the substrate. The cover is disposed on the substrate, coves the electronic component and has a recess. The liquid metal is formed between the recess and the electronic component.