Liquid-Metal Deformable Interconnects for Strain-Resilient Circuits

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Solution Overview

Problem

Conventional solutions fail to reliably deliver liquid metal into/through vias and channels for multi-layer electrical communication in flexible and stretchable electronics, and do not provide elastic deformable contacts or connections to prefabricated microelectronic devices.

Innovation Solution

A method for fabricating deformable electronic devices involves aligning substrates with channels and holes, filling them with liquid metal to create deformable interconnects that maintain electrical connections under strain, bending, and other deformations, using substrates with polyimide and PET films, and gallium-based alloys.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If conventional manufacturing solutions are used for rigid interconnects, then manufacturing precision is maintained, but the interconnects cannot accommodate deformation or strain in flexible electronics

Engineering Contradiction:

ImprovedeformabilityVSAvoidelectrical connection reliability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent changes the physical state of the interconnect material from solid to liquid, allowing the interconnect to flow and conform to deformed geometries while maintaining electrical conductivity. The liquid metal fills channels in both relaxed and strained states, adapting its shape to accommodate deformation.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses liquid metal (a fluid) to create deformable interconnects, analogous to hydraulic systems. The liquid metal flows through channels and via holes, filling them completely to establish reliable electrical connections that can accommodate deformation through fluid displacement rather than solid structural change.

Inventive Principle:

Principle #29Pneumatics and hydraulics

2Adaptability or versatility

If liquid metal is used to create deformable interconnects, then adaptability to deformation is improved, but reliable delivery of liquid metal into/through vias and channels becomes difficult

Engineering Contradiction:

ImprovestretchabilityVSAvoidliquid metal filling process

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent performs preliminary actions by first forming the substrate with integrated channels and via holes before introducing the liquid metal. The channels are pre-configured in both relaxed and strained states, and the liquid metal is then delivered to fill these pre-formed pathways, ensuring complete coverage and reliable connections.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent uses an intermediary process where the liquid metal is delivered through a controlled mechanism (such as capillary action or pressure-driven flow) that facilitates its movement into narrow channels and via holes. This intermediary delivery method overcomes the difficulty of directly placing liquid metal into complex geometries.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Adaptability or versatility

If the substrate is made flexible to enable deformation, then adaptability is improved, but manufacturing precision and alignment of circuit components may deteriorate

Engineering Contradiction:

ImproveflexibilityVSAvoidcomponent alignment

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent applies local quality by creating rigid channels and via holes within the flexible substrate at specific locations where electrical connections are needed. The flexible substrate provides overall adaptability, while the locally rigidified channels maintain manufacturing precision for component alignment and liquid metal delivery.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The deformable interconnects maintain conductivity and flexibility, with stretchability up to 100%, even when bent around a cylinder with a radius of 2-10 cm, enabling durable electrical communication in deformable electronic devices.

Implementation Method 1

filling, through the plurality of ports of the second substrate, the plurality of channels and the plurality of holes with a liquid metal material

Methodology Applied

Scientific EffectCapillary action: Capillary Action

Implementation Method 2

The plurality of deformable interconnects includes a first deformable interconnect produced by filling... The first deformable interconnect electrically connects the first and second circuit components... maintain electrical connections under strain, bending, and other deformations

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS20250338398A1Systems, methods, and devices for producing deformable electronic devices having deformable interconnects

Publication Date: 2025.10.30 META PLATFORMS TECHNOLOGIES LLC

AI summary

A method for fabricating a deformable electronic device includes obtaining a first substrate having a plurality of circuit components, and a second substrate having a plurality of channels and a plurality of holes. The method also includes assembling the first and second substrates to form a stack, in which holes in the plurality of holes of the second substrate are aligned with circuit components in the plurality of circuit components of the first substrates. The method further includes filling the plurality of channels and the plurality of holes with a liquid metal material, thereby producing a plurality of deformable interconnects in the stack. The plurality of deformable interconnects electrically connects the plurality of circuit components to form one or more circuits.