Liquid Metal Elastomer Thermal Interface for Glass Ceramic Heat Sinks
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Solution Overview
Problem
Portable information handling systems with low profile glass housings face challenges in thermal management due to reduced housing thickness, which limits processing component performance and increases susceptibility to failure.
Innovation Solution
Integration of a thermally conductive material as a heat sink within the glass ceramic housing, coupled with a liquid metal embedded elastomer and elastic graphene, to efficiently dissipate excess thermal energy from processing components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If housing thickness is reduced to minimize footprint and weight, then portability is improved, but thermal management capability deteriorates
Solution Approach 1:
The patent applies composite materials by integrating glass ceramic housing with embedded heat sink structures and thermally conductive materials. The glass ceramic provides aesthetic and structural properties while the embedded heat sink and thermal materials address thermal management, creating a multi-functional composite structure that overcomes the limitation of thin housings.
Solution Approach 2:
The patent transitions from two-dimensional surface cooling to three-dimensional embedded heat sinking within the housing structure. By integrating heat sink structures that extend into the housing thickness dimension and utilizing vertical thermal pathways, the system achieves effective thermal management despite reduced overall housing thickness.
2Volume of moving object
If housing thickness is reduced to minimize footprint, then portability is improved, but processing component performance deteriorates
Solution Approach 1:
The patent implements preliminary thermal management by pre-integrating heat sink structures and thermally conductive materials into the housing design before component installation. This preliminary preparation ensures that thermal pathways are already established, allowing high-performance processing components to operate at full capability without thermal constraints.
Solution Approach 2:
The patent introduces thermally conductive materials and heat sink structures as intermediary elements between processing components and the housing exterior. These intermediaries facilitate efficient heat transfer from high-performance components through the thin housing structure, enabling sustained high performance without excessive temperature rise.
3Strength
If glass ceramic material is used for housing to improve robustness, then durability is improved, but thermal conductivity deteriorates
Solution Approach 1:
The patent creates a composite structure where glass ceramic housing is combined with materials having complementary properties. The glass ceramic provides robustness and aesthetics while embedded heat sink materials (such as metals with high thermal conductivity) and thermally conductive compounds provide the necessary thermal pathways, achieving both durability and thermal management.
Solution Approach 2:
The patent applies local quality by concentrating thermally conductive materials specifically at heat generation points and thermal pathways rather than throughout the entire housing. The glass ceramic maintains its properties in non-critical areas while localized regions incorporate high thermal conductivity materials to create efficient heat transfer zones.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces thermal constraints, enhances processing component performance, and maintains an aesthetically pleasing low profile design while ensuring robustness and efficient thermal management.
Implementation Method 1
a heat sink of glass material pieces coated in graphene thermally interfaces with a processing component through a liquid metal embedded elastomer
Implementation Method 2
a heat sink of glass material pieces coated in graphene thermally interfaces with a processing component
Implementation Method 3
integrates a thermally conductive material as a heat sink within the glass ceramic housing, coupled with a liquid metal embedded elastomer and elastic graphene, to efficiently dissipate excess thermal energy from processing components
Data Source
AI summary
A docking station or portable information handling system processing component dissipates excess thermal energy through a glass ceramic heat sink disposed in a housing and interfaced with the processing component by a liquid metal embedded elastomer and elastic graphene. For example, plural pieces of glass ceramic material are each coated in graphene and vertically stacked in the housing thermally interfaced with each other by the liquid metal embedded elastomer having the elastic graphene coupled against the graphene coating to exchange thermal energy.