Liquid Metal Heat Dissipation Structure for Gap Filling
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Solution Overview
Problem
The high surface tension of liquid metal hinders its ability to evenly spread and fill gaps between electronic elements and heat dissipation modules, leading to reduced heat dissipation efficiency due to high thermal resistance and weak thermal conductivity in existing heat dissipation systems.
Innovation Solution
A method involving a heat dissipation cover with electrodes that are energized to reduce the surface tension of liquid metal by forming a metal oxide layer, allowing it to fill cavities more effectively and improve heat conduction between electronic elements and the heat dissipation module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If liquid metal is used to fill gaps between electronic elements and heat dissipation module, then heat dissipation efficiency is improved, but surface tension of liquid metal prevents it from spreading evenly and filling gaps completely
Solution Approach 1:
The patent changes the physical-chemical parameters of the liquid metal by controlling its oxidation state. By adjusting the oxygen content in the liquid metal, the surface tension is modified, enabling the liquid metal to spread evenly and fill gaps completely while maintaining high heat dissipation efficiency. This parameter change resolves the contradiction between heat dissipation performance and spreading ability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances heat dissipation efficiency by ensuring the liquid metal fills the gaps between electronic elements and the heat dissipation module, reducing thermal resistance and improving the reliability of electronic devices by preventing damage from external forces.
Implementation Method 1
energizing the foregoing electrodes, causing a potential difference therebetween so that a current flows through the liquid metal to reduce surface tension of the liquid metal
Implementation Method 2
The air in the gaps has high thermal resistance and extremely weak thermal conductivity, which hinders conduction of heat to the heat dissipation module
Data Source
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AI summary
Disclosed are a method for manufacturing a heat dissipation structure of an electronic element, a heat dissipation structure, and an electronic device. The method for manufacturing a heat dissipation structure of an electronic element includes: covering a periphery of an electronic element (110) with a heat dissipation cover (120), and hermetically connecting the heat dissipation cover (120) to a substrate (140) on which the electronic element (110) is installed, where the heat dissipation cover (120) is provided with a through hole (122a), and an inner wall of the heat dissipation cover (120) is provided with a plurality of electrodes (130); injecting a liquid metal through the through hole (122a) into an accommodating cavity (160) enclosed by the substrate (140) and the heat dissipation cover (120) until the entire accommodating cavity (160) is filled, and during this period, energizing the electrodes (130), so that a current flows through the liquid metal to reduce surface tension of the liquid metal; and sealing the through hole (122a). When the heat dissipation structure is manufactured by using the method according to the embodiment of this application, surface tension of the liquid metal can be reduced, so that the liquid metal can fill a cavity between an electronic element (110) and the heat dissipation cover (120), thereby increasing efficiency of dissipating heat from the electronic element (110).