Liquid Metal Thermal Interface Material with Phase-Change Layers
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Solution Overview
Problem
Existing thermal interface materials fail to efficiently transfer heat from electronic devices to cooling devices, leading to potential damage from excessive heat generation.
Innovation Solution
A liquid metal-based thermal interface material with multiple layers, including metals like gallium, indium, and interposed organic compounds that change phase with temperature, allowing metals to form alloys and enhance thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional thermal interface materials are used, then the device structure remains simple, but heat transfer efficiency is insufficient
Solution Approach 1:
The patent employs composite materials by combining liquid metal layers with organic interposed layers. The liquid metal provides high thermal conductivity while the organic layer provides structural stability and phase-change functionality. This composite structure achieves superior heat transfer efficiency compared to conventional single-material thermal interface materials.
Solution Approach 2:
The patent utilizes parameter changes through phase transition of the organic interposed layer. At lower temperatures, the organic layer remains solid providing structural support. At elevated temperatures, it transitions to liquid state, allowing the liquid metal layers to contact and form thermal pathways. This dynamic parameter change enables the material to adapt its thermal conductivity based on operating conditions.
2Reliability
If liquid metal is used to improve thermal conductivity, then heat transfer efficiency improves, but handling and transportation become difficult
Solution Approach 1:
The organic interposed layer acts as an intermediary between the liquid metal layers and the external environment. At room temperature, this intermediary layer maintains the liquid metal in a contained, solid-supported state, enabling easy handling and transportation. When heated, the intermediary transitions to allow the liquid metal to flow and form thermal contact, thus mediating between the need for high thermal conductivity and ease of handling.
Solution Approach 2:
The patent exploits phase transitions of the organic interposed layer to control the state of the liquid metal. The organic layer transitions from solid to liquid at a specific temperature threshold, which in turn allows the liquid metal to transition from a contained state to a flowing state that forms thermal pathways. This phase transition mechanism enables the material to be easy to handle at low temperatures while achieving high thermal conductivity at operating temperatures.
3Reliability
If multiple metal layers are combined to form alloys, then thermal conductivity enhances, but manufacturing complexity increases
Solution Approach 1:
The patent segments the thermal interface material into distinct functional layers: liquid metal layers for thermal conduction and organic interposed layers for structural support and phase-change control. This segmentation allows each layer to be manufactured and optimized independently, reducing overall manufacturing complexity while achieving superior thermal conductivity through the synergistic combination of layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat transfer efficiency by forming liquid alloys at elevated temperatures, ensuring effective heat dissipation and ease of handling in solid form for transportation and application.
Implementation Method 1
an interposed layer configured to change phase based on temperature, such that the first metal layer and the second metal layer are in direct contact with each other when the interposed layer is in the liquid state
Implementation Method 2
metal atoms may start diffusing into each other. Upon contacting and diffusing, melting of the first metal layer and the second metal layer may occur
Implementation Method 3
Upon contacting and diffusing, melting of the first metal layer and the second metal layer may occur because a melting point of alloy is usually lower than those of individual first metal and second metal
Implementation Method 4
configured to enhance thermal conductivity between the two surfaces... Improves heat transfer efficiency by forming liquid alloys at elevated temperatures
Data Source
AI summary
A multilayer thermal interface material includes: a first metal layer comprising a first metal; a second metal layer comprising a second metal; and an interposed layer disposed between the first metal layer and the second metal layer. The first metal layer, the second metal layer, and the interposed layer are in a solid state at or below a first temperature. The interposed layer is configured to change phase based on temperature and is in a phase other than a solid state at a second temperature, such that the first metal layer and the second metal layer contact each other.