Liquid Metal Heat Dissipation Structure for Vibration Leak Containment
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Solution Overview
Problem
Portable information devices using liquid metal as a thermal interface material face challenges in preventing leakage due to vibrations, which can lead to heat dissipation inefficiencies and reliability issues.
Innovation Solution
A heat dissipation structure incorporating a thermal putty with high viscosity and shape retainability between the substrate and heat exchanger plate, along with a sponge to create a two-stage sealing system, effectively containing liquid metal and maintaining thermal conductivity and sealing performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid metal is used as thermal interface material, then heat dissipation efficiency is improved, but leakage risk increases due to vibrations
Solution Approach 1:
The patent introduces a wall member made of cushioning silicone rubber as an intermediary component between the substrate and heat exchanger plate. This wall member surrounds the die and creates a sealed enclosure that contains the liquid metal, preventing its leakage while maintaining the thermal conductivity benefits of liquid metal as the thermal interface material.
Solution Approach 2:
The wall member is constructed from flexible cushioning silicone rubber that forms a sealed barrier around the die. This flexible material can accommodate vibrations and thermal expansion while maintaining the seal, effectively containing the liquid metal without compromising the thermal interface performance.
2Reliability
If wall member is added to prevent liquid metal leakage, then reliability is improved, but device complexity increases
Solution Approach 1:
The wall member made of cushioning silicone rubber serves multiple functions simultaneously: it acts as a seal to prevent liquid metal leakage, provides mechanical cushioning against vibrations, and maintains the structural integrity of the heat dissipation assembly. This multi-functionality reduces the need for additional separate components.
Solution Approach 2:
The patent employs a composite structure where the wall member combines the sealing properties of silicone rubber with the thermal management requirements of the heat dissipation system. This composite approach integrates leakage prevention and thermal management functions into a unified component design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution prevents liquid metal leakage, enhances heat dissipation reliability, and ensures stability under vibration, maintaining effective thermal conductivity and electrical insulation.
Implementation Method 1
a liquid metal interposed between the die and the heat dissipator
Implementation Method 2
a thermal putty interposed between the substrate and the heat dissipator in a state of sealing therebetween
Data Source
AI summary
A heat dissipation structure, of a semiconductor chip that includes a substrate and a die provided on a top surface of the substrate, includes: a heat dissipator provided along a surface of the die; a liquid metal interposed between the die and the heat dissipator; and a thermal putty interposed between the substrate and the heat dissipator in a state of sealing therebetween and surrounding the die.