Liquid-Metal Microfluidic Cooling for Circuit Boards and Cables
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Solution Overview
Problem
Conventional heat dissipation methods in electronic devices, such as heatsinks, are bulky and costly, and passive liquid metal cooling systems do not actively transfer heat, limiting their effectiveness in managing heat generated by high-power semiconductor devices and circuit boards.
Innovation Solution
The implementation of microfluidic channels with liquid metal and pumps to actively cool circuit boards and high-current applications by dynamically moving liquid metal through these channels, enhancing heat transfer and reducing the need for oversized heatsinks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heatsinks are used for heat dissipation, then heat can be dissipated to cooling medium, but the device size and cost increase significantly
Solution Approach 1:
The patent uses liquid metal flowing through microfluidic channels to transfer heat away from the circuit board. This hydraulic cooling system replaces the solid heatsink structure with a fluid-based heat transfer mechanism, achieving superior cooling efficiency with significantly reduced weight and size. The liquid metal circulates through channels in direct contact with or near the heat-generating components, providing targeted and efficient heat removal.
Solution Approach 2:
The patent employs liquid metal with superior thermal conductivity parameters compared to conventional cooling media. By changing the cooling fluid from air or water to liquid metal, the heat transfer coefficient and thermal conductivity are dramatically improved, allowing for more effective heat dissipation with smaller channel dimensions and reduced overall system size.
2Temperature
If passive liquid metal cooling systems are used, then heat can be transferred, but active heat transfer and precise temperature control are limited
Solution Approach 1:
The patent implements an active cooling system where the liquid metal flow rate can be dynamically adjusted to control temperature. The system transitions from passive heat transfer to active thermal management, allowing real-time optimization of cooling performance based on operational conditions. This enables precise temperature control of critical components by varying the flow characteristics of the liquid metal.
Solution Approach 2:
The patent incorporates temperature sensors and control mechanisms that monitor thermal conditions and adjust the liquid metal flow accordingly. This feedback system enables closed-loop temperature control, where thermal data from the circuit board informs adjustments to the cooling rate, ensuring components operate within optimal temperature ranges under varying load conditions.
3Temperature
If microfluidic channels with liquid metal are used, then heat transfer is enhanced, but system complexity increases with pumps and channels
Solution Approach 1:
The patent integrates multiple functions into the liquid metal system: it serves as both the cooling medium and an electrically conductive interconnect replacement. The liquid metal simultaneously performs heat transfer and electrical connection functions, eliminating the need for separate copper traces and cooling infrastructure, thereby reducing overall system complexity despite the addition of microfluidic channels.
Solution Approach 2:
The patent embeds microfluidic channels within or adjacent to the circuit board structure, nesting the cooling infrastructure within the existing device architecture. The channels are integrated into the PCB layers or mounted in close proximity, allowing the cooling system to be incorporated without requiring separate external cooling components, thus minimizing the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This active cooling method effectively distributes heat across larger surface areas, maintains precise temperature control, reduces weight, and increases the longevity of connections, while being safer and more efficient than traditional copper wire-based cooling systems.
Implementation Method 1
liquid metal disposed in a microfluidic channel... actively cool at least a portion of the circuit board
Implementation Method 2
distributes heat across larger surface areas... maintains precise temperature control
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3
AI summary
Fluidic channels and pumps for active cooling of cables or circuit boards are described. One assembly includes a conductor having a length between a first end of the cable and a second end of the cable and a fluidic channel structure that at least partially surrounds the conductor along the length of the conductor. Another assembly includes a circuit board that includes a substrate and a microfluidic channel structure disposed on the substrate, the microfluidic channel structure comprising liquid metal disposed in a microfluidic channel.