Liquid Metal Heat Dissipation Structure for Overflow Stability

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Solution Overview

Problem

Conventional heat dissipation structures for electronic components, such as CPUs and GPUs, face inefficiencies in heat transfer due to close component arrangements, leading to temperature rises and potential electrical issues like short circuits and unstable dissipation, especially during overclocking.

Innovation Solution

A heat dissipation structure featuring a fixation unit with a hollow area comprising non-masking and masking areas, and recesses, designed to accommodate volume changes of a liquid metal heat dissipation unit, reducing electrical conductivity and overflow risks, thereby enhancing heat dissipation efficiency and stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a metal cooling fin is used to improve heat dissipation efficiency, then heat dissipation efficiency is improved, but electrical conductivity increases leading to short circuit risks

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidelectrical conductivity

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a non-conductive adhesive layer as an intermediary between the metal cooling fin and the circuit board. This adhesive layer maintains the high heat dissipation efficiency of the metal cooling fin while blocking electrical conductivity, thereby preventing short circuits. The adhesive acts as a mediator that allows thermal energy transfer while blocking electrical current.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If liquid metal is used as heat dissipation unit, then heat dissipation performance is improved, but volume change during phase transition causes overflow and instability

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidheat dissipation stability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent utilizes the phase change parameters of liquid metal (melting point, boiling point, density changes) to achieve efficient heat dissipation through latent heat absorption and release. By designing the system to operate within specific temperature ranges and providing expansion space, the patent harnesses the parameter changes of liquid metal for improved heat dissipation while managing the associated volume changes.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent incorporates an expansion space design in advance to accommodate the volume changes that occur during liquid metal phase transitions. This pre-planned cushioning space prevents overflow and maintains system stability, allowing the liquid metal to expand and contract without causing damage or performance degradation.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Volume of moving object

If components are arranged closely for miniaturization, then device size is reduced, but heat dissipation effectiveness decreases leading to temperature rise

Engineering Contradiction:

Improvedevice sizeVSAvoidheat dissipation effectiveness

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The patent employs thin-film heat dissipation materials and flexible thermal interface materials that can be applied in confined spaces. These thin films provide efficient thermal conduction without adding significant volume, allowing effective heat dissipation in miniaturized devices where component spacing is limited.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The structure effectively reduces electrical leakage and underclocking risks, maintaining stable heat dissipation during high-power operations and overclocking, improving the reliability and service life of electronic components.

Implementation Method 1

a heat dissipation unit (1) and a fixation unit (2). The fixation unit (2) is surroundingly arranged on a periphery of a heating source (3)

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The heat dissipation unit (1) has a first state and a second state. In certain embodiments, the heat dissipation unit (1) is formed by liquid metal

Methodology Applied

Scientific EffectPhase change: Phase Change

Implementation Method 3

A sum of the first volume and the second volume is at least greater than a predetermined volume change of the heat dissipation unit (1)

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS12262507B2Heat dissipation structure

Publication Date: 2025.03.25 CLEVO

AI summary

A heat dissipation structure is provided. The heat dissipation structure includes a heat dissipation unit and a fixation unit. The fixation unit has a bottom and a wall that jointly define a hollow area. The fixation unit is surroundingly arranged on a periphery of a heating source. The hollow area has a first non-masking area, a second non-masking area, and a masking area. The masking area corresponds to at least one part of the heat dissipation unit, and the first non-masking area and the second non-masking area are respectively arranged on opposite sides of the masking area. The first non-masking area has a first volume, the second non-masking area has a second volume, and a sum of the first volume and the second volume is at least greater than a predetermined volume change of the heat dissipation unit.