Liquid Metal Semiconductor Package for Heat Dissipation and Leak Control
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Solution Overview
Problem
Conventional semiconductor devices face challenges in effectively dissipating heat generated by electronic components, as existing heat dissipation methods are inefficient.
Innovation Solution
A semiconductor device design that incorporates a substrate, an electronic component, a cover with a recess, and liquid metal, where the liquid metal is formed between the recess and the electronic component to facilitate heat dissipation, utilizing the cover's thermal conductivity and the liquid metal's high thermal conductivity to manage heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipation methods are used, then the structure is simple, but heat dissipation efficiency is poor
Solution Approach 1:
The patent changes the physical state parameter of the heat dissipation medium from solid (conventional thermal paste) to liquid metal, which has superior thermal conductivity. This parameter change enables significantly improved heat dissipation efficiency while maintaining a relatively simple overall structure, as the liquid metal directly fills the gap between the electronic component and heat sink without requiring complex thermal interface materials.
Solution Approach 2:
The patent employs a composite structure combining liquid metal with the cover and electronic component. The liquid metal forms a thermal interface layer that complements the solid components, creating a hybrid heat dissipation system that leverages the high thermal conductivity of liquid metal while maintaining structural integrity through the solid cover and component assembly.
2Temperature
If liquid metal is used for heat dissipation, then thermal conductivity is enhanced, but liquid metal may leak
Solution Approach 1:
The patent applies preliminary anti-action by designing the cover with a recess that protrudes into the space between the electronic component and heat sink. This recess structure creates a physical barrier that prevents liquid metal from leaking outward before it can escape, proactively addressing the leakage issue rather than reacting to it. The recess forms a containment feature that restricts liquid metal movement while preserving thermal contact.
Solution Approach 2:
The recess in the cover acts as an intermediary structure between the liquid metal and the external environment. It serves as a containment mechanism that mediates the potential leakage problem by providing a physical boundary that holds the liquid metal in place, allowing the liquid metal to maintain thermal contact with the heat sink without risking leakage to surrounding components.
3Temperature
If liquid metal is used, then heat dissipation improves, but external impurities may enter the device
Solution Approach 1:
The recess structure in the cover provides preliminary protection against external impurities by creating a sealed or restricted access environment. The protruding recess forms a barrier that prevents contaminants from reaching the liquid metal and electronic component interface, proactively blocking the contamination pathway while maintaining the heat dissipation function.
Solution Approach 2:
The cover with recess serves as an intermediary protective layer between the external environment and the internal components. It mediates the interaction between external impurities and the liquid metal-electronic component interface, filtering or blocking contaminants while allowing thermal energy to pass through via the liquid metal contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat generated by electronic components through the liquid metal and cover, enhancing thermal conductivity and reducing warpage, while preventing liquid metal leakage and external impurities from entering the device.
Implementation Method 1
The liquid metal is formed between the recess and the electronic component... utilizing the cover's thermal conductivity and the liquid metal's high thermal conductivity to manage heat transfer
Data Source
Figure 1A
Figure 1B
Figure 1C
AI summary
A semiconductor device includes a substrate, an electronic component, a cover and a liquid metal. The electronic component is disposed on the substrate. The cover is disposed on the substrate, coves the electronic component and has a recess. The liquid metal is formed between the recess and the electronic component.