Liquid Metal Power and Cooling for Digital Systems
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Modern nuclear reactors face challenges in maintaining digital system integrity and operation due to high heat environments, which can lead to 'loss of integrity' or 'loss of operation' of digital systems, especially during severe accidents, as conventional cooling methods struggle to manage the extreme temperatures and heat generation in dense electronic components.
Innovation Solution
A passive system utilizing liquid metal for both power delivery and cooling, which includes a digital device coupled with a printed circuit board and a hollow conductive channel to circulate liquid metal for power transfer and heat dissipation, utilizing a closed-loop system with a heat exchanger and electromagnetic pump for enhanced cooling, and potentially electrically charging the liquid metal for power delivery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling methods (fans, heat sinks, liquid cooling) are used to manage heat in digital systems, then cooling capability is improved, but system complexity and reliability under extreme conditions deteriorate
Solution Approach 1:
The patent combines power delivery and cooling functions into a single integrated system using liquid metal. The liquid metal flows through conductive channels that serve dual purposes: delivering electrical power to digital devices and removing heat simultaneously, eliminating the need for separate power supplies and cooling systems.
Solution Approach 2:
The liquid metal serves multiple functions: it acts as an electrical conductor for power delivery, a coolant for heat removal, and a thermal storage medium. This multi-functionality reduces system complexity while improving reliability, as the same substance performs critical power and thermal management roles.
2Productivity
If digital system component density and processing speed are increased, then computational power is improved, but heat generation increases causing loss of integrity and operation
Solution Approach 1:
The patent uses liquid metal flow through conductive channels to remove heat from high-density digital components. The hydraulic flow of liquid metal provides efficient convective heat transfer, capable of handling the extreme heat generation from fast, dense electronic components that conventional air cooling cannot manage.
Solution Approach 2:
The patent changes the thermal and electrical parameters of the cooling medium by using liquid metal instead of conventional coolants. Liquid metal has superior thermal conductivity and electrical conductivity, enabling it to efficiently remove heat while simultaneously providing power delivery, thus managing heat generation from high-productivity digital systems.
3Reliability
If redundant digital systems with extensive self-diagnosis are implemented, then system reliability is improved, but heat generation and system complexity increase
Solution Approach 1:
The patent merges power delivery and thermal management into a single liquid metal circulation system. This integration reduces the number of separate components (power supplies, cooling systems, pipes, pumps) while maintaining the reliability needed for redundant digital systems with extensive self-diagnosis capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively maintains digital system operation by continuously providing power and cooling, preventing 'loss of integrity' or 'loss of operation' during high heat conditions, while minimizing the risk of plant damage and radioactive material escape, and reducing the need for external cooling devices, thus ensuring robust digital control functions.
Implementation Method 1
convey electrical power to the digital device during a power loss
Implementation Method 2
transfer heat generated by the digital device
Implementation Method 3
circulate the liquid metal to flow within the hollow conductive channel body
Implementation Method 4
The liquid metal may enter the heat exchanger and may transfer heat to a cooler gas flowing through the heat exchanger
Implementation Method 5
an electromagnetic pump to increase a flow of the liquid metal
Data Source
AI summary
Example embodiments disclose a passive system of power and cooling with a liquid metal for a digital system. The passive system may include a digital device operatively coupled to a printed circuit board, a hollow conductive channel body attached to the printed circuit board to circulate the liquid metal to flow within the conductive channel so as to convey electrical power to the digital device during a power loss and transfer heat generated by the digital device, and a tube to deliver the liquid metal in and out of the hollow conductive channel body. A method of operating a liquid metal may involve the use of the passive system.