Liquid Metal 3D Printing Temperature Control for Drop Bonding

The patent uses thermal conduction as an intermediary mechanism to transfer temperature information from the deposition location to the sensor. The sensor measures temperature at a remote location where it is cooler and easier to position, while the measured temperature reflects the temperature at the deposition location through thermal conduction through the substrate or build plate. This resolves the contradiction by enabling accurate temperature measurement without placing contact sensors directly in the high-temperature deposition zone.

The patent applies preliminary thermal conduction during the measurement process itself. By measuring temperature at an offset location after the deposition event, the system relies on the thermal field to have already propagated the temperature information from the deposition zone to the sensor location. This preliminary thermal diffusion action enables accurate remote temperature sensing without requiring direct sensor placement at the deposition point.

The patent employs dynamic thermal conduction modeling to account for the time-dependent temperature changes. The system measures temperature at different times relative to the deposition event and uses the known thermal properties of the materials and substrate to dynamically calculate the temperature at the deposition location. This dynamic approach allows the system to capture rapid temperature changes while maintaining timing precision through computational correction rather than requiring ultra-precise direct measurement.