Liquid Metal Interconnect Assembly via Capillary Self-Diffusion
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Solution Overview
Problem
Existing interconnect technologies for integrated circuit devices, such as solder-based methods, are permanent and require multiple thermal exposure operations, which can be detrimental to thermally sensitive components, and conventional printing techniques for liquid metal interconnects are material-consuming, costly, or lack scalability.
Innovation Solution
A self-diffusion process using Gallium-based liquid metal interconnects facilitated by capillary action and a slip layer material to form connections at room temperature, allowing for minimal energy consumption and precise, scalable interconnect networks without complex processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder-based interconnection technologies are used, then permanent and reliable interconnections are achieved, but multiple thermal exposure operations are required which can be detrimental to thermally sensitive components
Solution Approach 1:
The patent changes the physical state parameter of the interconnect material from solid (solder) to liquid (gallium-based alloy), enabling interconnection formation at room temperature through capillary action rather than requiring high-temperature thermal exposure processes
Solution Approach 2:
The patent replaces the thermal-based soldering process with a capillary-driven liquid metal flow mechanism, where surface tension and capillary forces automatically guide the liquid metal into interconnection structures without external heating
2Ease of manufacture
If conventional printing techniques are used for liquid metal interconnects, then interconnect formation is achieved, but the process is material-consuming, costly, and lacks scalability
Solution Approach 1:
The patent employs self-diffusion channels that automatically guide liquid metal from reservoirs to interconnection points through capillary action, eliminating the need for external printing equipment and reducing material waste through precise, on-demand delivery
Solution Approach 2:
The patent introduces self-diffusion channels as intermediary structures that mediate the transfer of liquid metal from bulk reservoirs to specific interconnection locations, enabling controlled material distribution without complex printing mechanisms
3Ease of operation
If traditional sockets or interposers are used for interconnections, then device assembly is achieved, but the complexity and processing time increase
Solution Approach 1:
The patent merges the interconnection function and mechanical attachment function into a single integrated liquid metal interconnect structure, eliminating the need for separate sockets or interposers that would otherwise be required
Solution Approach 2:
The liquid metal interconnect structure performs multiple functions simultaneously: providing electrical connection, mechanical bonding, and thermal management, thereby replacing multiple separate components with a single multi-functional element
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid, reversible, and precise interconnect formation with higher pin counts and finer pitches, reducing processing time and costs, and eliminating the need for traditional sockets or interposers, while being applicable to various late-attach applications.
Implementation Method 1
self-diffusion channels in a component (e.g., a substrate, such as an integrated circuit package substrate) allow LM to flow to interconnect points of the component based on capillary force
Data Source
AI summary
In one embodiment, an integrated circuit device includes a substrate and a component coupled to the substrate. The substrate includes first reservoirs comprising Gallium-based liquid metal (LM), second reservoirs, first channels between the first reservoirs, and second channels between the second reservoirs and respective first reservoirs. The component includes circuitry and conductive contacts connected to the circuitry. Each contact defines a cavity and a portion of each conductive contact is within a respective first reservoir of the substrate such that it is in contact with the LM in the first reservoir. The component further includes dielectric lines between the conductive contacts, and each dielectric line is at least partially within a respective first channel of the substrate.