Liquid Metal Interconnects for Dense Modular Server Packages
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Solution Overview
Problem
Traditional server and package architecture face challenges in high-density interconnects due to mechanical loading forces, which increase the area consumed by components and limit co-location, leading to yield loss and increased manufacturing costs.
Innovation Solution
The use of liquid metal interconnects (LMIs) provides a non-permanent connection between processor packages and motherboards, allowing for high-density integration without significant package growth, maintaining electrical properties comparable to solder connections, and enabling architectural flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional mechanical loading interconnects are used to maintain electrical connections, then connection reliability is improved, but baseboard area consumption increases significantly
Solution Approach 1:
The patent replaces traditional mechanical loading interconnects with a liquid metal interconnect system. The liquid metal is contained in wells on the baseboard and makes contact with conductive elements on the processor package through capillary action and surface tension, eliminating the need for sustained mechanical loading forces while maintaining reliable electrical connections.
Solution Approach 2:
The patent utilizes the fluid properties of liquid metal (hydraulic principle) to create the interconnect. The liquid metal flows into wells and maintains electrical contact through its fluid nature, allowing connection without rigid mechanical structures, thereby reducing the baseboard area required for mechanical loading hardware.
2Quantity of substance
If the number of connections is increased to achieve high-density interconnect, then interconnect capability is improved, but mechanical loading force requirements increase
Solution Approach 1:
By replacing mechanical loading with liquid metal contact, the patent enables high-density interconnect (4000-6000 connections) without proportionally increasing mechanical loading forces. The liquid metal system naturally adapts to contact multiple conductive elements simultaneously through its fluid properties.
Solution Approach 2:
The patent changes the physical state of the interconnect from solid mechanical contact to liquid metal contact. This parameter change allows the interconnect system to accommodate a high number of connections without requiring increased mechanical force, as the liquid metal can conform to and contact multiple conductive elements through capillary action.
3Device complexity
If functionality is integrated into the processor package to reduce interconnections, then interconnect complexity is reduced, but processor package size increases
Solution Approach 1:
The patent segments the interconnect function from the processor package by placing liquid metal wells on the baseboard rather than integrating all interconnect structures into the processor package. This allows functionality integration while maintaining a compact processor package size, as the liquid metal system on the baseboard handles the interconnection burden.
4Area of stationary object
If components are placed in close proximity to minimize mechanical loading impact, then space utilization is improved, but yield loss increases
Solution Approach 1:
By replacing mechanical loading with liquid metal interconnects, the patent allows components to be placed in close proximity without compromising reliability through mechanical failure. The liquid metal system is more tolerant of thermal expansion and mechanical stress, enabling higher component density while maintaining yield.
Solution Approach 2:
The patent changes the interconnect material state from solid to liquid, which fundamentally alters the stress and strain characteristics. This parameter change allows components to be placed closer together without increasing yield loss, as the liquid metal can accommodate thermal and mechanical variations better than rigid mechanical interconnects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
LMIs reduce yield loss by allowing easy replacement of defective components, improve compute density, and minimize mechanical loading requirements, thus reducing overall packaging costs and maintaining electrical functionality.
Implementation Method 1
The liquid metal interconnect (LMI) is a non-permanent interconnect that does not require sustained mechanical loading force to maintain electrical connection
Implementation Method 2
liquid metal structures...maintaining electrical properties comparable to solder connections
Data Source
AI summary
An electronic device and associated methods are disclosed. In one example, the electronic device includes an integrated circuit (IC) package substrate including package interconnect and a first substrate surface; a processor IC attached to the first substrate surface and electrically connected to the package interconnect; a liquid metal well array including multiple liquid metal wells, a first array surface attached to the first substrate surface, and a second array surface; and a companion component to the processor IC attached to the second array surface of the liquid metal well array.