Liquid Metal Interconnect Sealing for Low-Stress Socket Connection
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Solution Overview
Problem
Conventional socket mounting methods for integrated circuit components on circuit boards, such as soldering and compression mounting, can cause stress and warpage, and require high force, especially for high-pin count components, leading to potential failure and reliability issues.
Innovation Solution
A liquid metal interconnect array sealed by a foam cap layer and a fabric layer is used, allowing the bed of nails socket to pierce the foam cap layer for electrical connection without the stress of soldering and the high force of compression mounting, with the fabric layer preventing damage to the foam cap layer and maintaining the integrity of the liquid metal interconnects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering is used to connect socket to circuit board, then electrical connection is achieved, but stress and warpage are induced to the circuit board
Solution Approach 1:
The patent replaces the mechanical soldering process with a liquid metal transfer mechanism. The liquid metal is deposited from the socket contacts onto the circuit board contact pads, eliminating the need for thermal soldering processes that cause stress and warpage. This substitution maintains electrical connection reliability while avoiding the harmful thermal and mechanical effects of traditional soldering.
Solution Approach 2:
The patent utilizes capillary action (a fluid dynamics principle) to control liquid metal flow and transfer. The liquid metal flows through the socket contacts and onto the contact pads via capillary forces, enabling connection without mechanical soldering. This hydraulic-like fluid control mechanism resolves the contradiction by providing reliable electrical connection without the stress of traditional mechanical joining methods.
2Reliability
If compression mounting is used to connect integrated circuit component, then electrical connection is achieved, but large amount of force is required, particularly for high-pin count components
Solution Approach 1:
The patent replaces mechanical compression mounting with a liquid metal bonding mechanism. The liquid metal is transferred from the socket contacts to the circuit board pads, creating a self-bonding connection that does not require high compression forces. This substitution eliminates the need for forceful mechanical pressing, especially beneficial for high-pin count components where compression forces would be excessively large.
Solution Approach 2:
The patent employs a composite connection structure involving liquid metal, socket contacts, and circuit board pads. The liquid metal acts as a bonding agent that combines the electrical conductivity of metals with the structural properties of the socket and board. This composite approach enables reliable electrical connection without requiring the high forces needed for traditional compression mounting of high-pin count components.
3Reliability
If foam cap layer is used to seal liquid metal interconnects, then liquid metal leakage is prevented, but repeated piercing may damage the foam cap layer
Solution Approach 1:
The patent creates a composite seal layer by integrating fabric fibers into the foam cap material. This composite structure combines the sealing properties of foam with the strength and durability of fabric. The fabric reinforcement prevents the foam from being easily damaged by repeated piercing actions, while maintaining the liquid-tight sealing capability. This resolves the contradiction between sealing integrity and structural durability.
Solution Approach 2:
The patent applies different material properties to different regions of the seal layer. The foam cap provides local sealing quality at the contact points, while the integrated fabric provides local structural strength where piercing occurs. This spatial differentiation of material functions allows the seal layer to simultaneously achieve both sealing integrity and resistance to piercing damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a reliable and stress-free electrical connection for integrated circuit components, reducing the risk of failure and improving the durability of the interconnect interface by preventing liquid metal leakage and maintaining the foam cap layer's integrity.
Implementation Method 1
an array of liquid metal interconnects sealed by a seal layer. In use, a bed of nails socket on a circuit board can interface with the liquid metal interconnect array
Implementation Method 2
The fabric layer can prevent and mitigate damage to the foam cap layer, reducing failure of the interface between the liquid metal interconnect array and the bed of nails socket
Data Source
AI summary
Technologies for integrated circuit components with liquid metal interconnects are disclosed. In the illustrative embodiment, a bed of nails socket can mate with an integrated circuit component with liquid metal interconnects. The nails pierce a foam cap layer that seals the liquid metal interconnects, electrically coupling the nails to the liquid metal interconnects. A fabric layer adjacent to the foam cap layer helps secure the foam cap layer, preventing small pieces of the foam cap layer that may be dislodged during repeated insertion into a bed of nails socket from becoming separated from the foam cap layer. The fabric layer can provide additional benefits, such as removing more of the liquid metal from the nails when the integrated circuit component is removed from the bed of nails socket.