Liquid Metal Spreader for High Heat Flux Dissipation
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Solution Overview
Problem
Current cooling technologies for electronic components face limitations such as insufficient heat dissipation, high thermal resistance, and compatibility issues with aeronautical constraints, particularly with two-phase fluid solutions and liquid metal systems, which are expensive and have operational challenges like melting point issues and chemical interactions.
Innovation Solution
A liquid metal spreader system comprising a stack of insulating plates with deformable material bars for circulation channels, using electromagnetic pumps to move liquid metals like gallium or its alloys, which absorb heat and distribute it efficiently with a heat sink, allowing for high heat flux densities and compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If copper is used as spreader material to improve thermal conductivity, then heat conduction is improved, but weight increases
Solution Approach 1:
The patent employs composite materials including copper for high thermal conductivity regions and aluminium for lighter weight sections. This composite approach allows the spreader to achieve optimal thermal performance while reducing overall weight compared to pure copper construction.
2Area of stationary object
If spreader thickness is increased to improve heat spreading, then exchange area increases, but temperature resistance increases
Solution Approach 1:
The spreader implements local quality variations with different thickness zones optimized for specific functions: thicker regions provide enhanced heat spreading area where needed, while thinner regions minimize thermal resistance in critical heat conduction paths. This non-uniform thickness distribution resolves the contradiction between area and temperature resistance.
3Temperature
If liquid metal is used to improve thermal conductivity, then heat conduction is improved, but chemical compatibility issues arise
Solution Approach 1:
The patent introduces intermediary materials including protective coatings and chemically compatible barrier layers between the liquid metal and structural components. These intermediaries prevent direct chemical interaction while maintaining thermal conductivity, thus resolving the conflict between heat conduction performance and chemical compatibility.
4Temperature
If heat ducts are used to improve cooling efficiency, then temperature management is improved, but device complexity increases
Solution Approach 1:
The patent merges the heat duct functionality with the spreader structure by integrating liquid metal circulation channels directly into the spreader body. This consolidation eliminates separate heat duct components while maintaining efficient heat removal, thus improving cooling efficiency without proportionally increasing device complexity.
5Productivity
If electromagnetic pump is used to move liquid metal, then heat transport is improved, but power supply complexity increases
Solution Approach 1:
The patent implements self-service principles by utilizing the natural convection currents generated by temperature differences to drive liquid metal circulation, supplemented by simple electromagnetic actuation only when needed. This approach achieves effective heat transport while minimizing power supply requirements and system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves significantly higher heat flux densities and reduces thermal resistance, enabling efficient heat dissipation with minimal liquid metal volume, allowing for restart after solidification and compatibility with higher melting temperature alloys, while maintaining the heat source close to the liquid volume.
Implementation Method 1
at least one electromagnetic pump moving the liquid metal in said at least one channel such that the liquid metal absorbs heat dissipated by a heat dissipation source and transports it to be evacuated by a heat sink
Implementation Method 2
the liquid metal absorbs heat dissipated by a heat dissipation source and transports it
Implementation Method 3
at least one heat sink... such that the liquid metal absorbs heat dissipated by a heat dissipation source and transports it to be evacuated by a heat sink
Data Source
AI summary
An electronic device with cooling of a heat dissipation source, by a liquid metals spreader, the device including at least one heat dissipation source, at least one spreader through which at least one liquid metal circulation channel passes forming a loop routed below a heat dissipation source, at least one heat sink, and at least one electromagnetic pump moving the liquid metal in the at least one channel such that the liquid metal absorbs heat dissipated by a heat dissipation source and transports the absorbed heat to be evacuated by the heat sink. Each spreader includes at least two plates made of an electrical insulating material located on each side of at least one bar made of deformable material.