Liquid Metal Interconnect Testing Adapter for Sealing Cap Protection
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Solution Overview
Problem
The existing methods for connecting integrated circuit components to circuit boards, such as soldering or compression mounting, can cause stress and warpage, and repeated piercing of a sealing cap layer can lead to failure of the liquid metal interconnect array, especially during testing when the connection is made and broken multiple times.
Innovation Solution
A bed of nails adapter with a bed of nails array on one side and a land grid array on the other side, allowing the adapter to mate with the integrated circuit component and remain connected to various test interface units without repeatedly piercing the sealing cap layer, thereby reducing stress and preventing leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a bed of nails socket repeatedly pierces the sealing cap layer during testing, then electrical connection is achieved, but the sealing cap layer is damaged causing liquid metal leakage and interconnect failure
Solution Approach 1:
A liquid metal transfer adapter is introduced as an intermediary component between the bed of nails socket and the liquid metal interconnect array. The adapter includes a liquid metal transfer array that makes initial contact with the liquid metal interconnects through the sealing cap layer, establishing electrical connection without requiring the bed of nails socket to repeatedly pierce the sealing cap layer. This mediator protects the sealing cap layer from damage while enabling reliable testing operations.
2Reliability
If solder is used to connect socket to circuit board, then electrical connection is achieved, but stress is induced to the circuit board causing warpage and solder joint failure
Solution Approach 1:
The patent replaces the mechanical soldering system with a liquid metal transfer system. Instead of using solder to create rigid mechanical and electrical connections, the invention uses liquid metal that can be transferred through the adapter to establish electrical connections without inducing stress or warpage to the circuit board. This substitution eliminates the harmful mechanical stresses while maintaining connection reliability.
3Reliability
If compression mounting is used for high-pin count components, then connection is achieved, but large amount of force is required causing potential damage
Solution Approach 1:
The liquid metal transfer adapter serves as a mediator that distributes the connection force across multiple contact points rather than requiring concentrated compression force. The adapter's liquid metal transfer array establishes electrical connections with minimal force applied to the sealing cap layer, avoiding the large mounting forces that would be required for direct compression mounting of high-pin count components.
Data Source
AI summary
Technologies for testing integrated circuit components with liquid metal interconnects are disclosed. In the illustrative embodiment, a bed of nails adapter can mate with an integrated circuit component with liquid metal interconnects. The nails pierce a sealing cap layer that seals the liquid metal interconnects, electrically coupling the nails to the liquid metal interconnects. An underside of the bed of nails adapter has an array of pads that are coupled to the nails. The array of pads may be used to mate the bed of nails adapter and integrated circuit component with several land grid array sockets for testing of the integrated circuit component. As the bed of nails adapter does not need to be removed as the integrated circuit component is moved to a new land grid array socket, the number of times the sealing cap layer is pierced by nails during testing is reduced.