Liquid Metal Thermal Interface for Warped IC Packages

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Solution Overview

Problem

Warpage issues arise in integrated circuit packages due to material differences, worsening with package size increase, affecting heat dissipation efficiency.

Innovation Solution

The use of a permeable plate with liquid metal as a heat-dissipation medium, which migrates through the plate to conform to package surfaces, improving contact and heat dissipation by reshaping with temperature changes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If package size is increased to improve functionality and integration level, then more package components can be bonded together, but warpage becomes more severe

Engineering Contradiction:

Improvefunctionality and integration levelVSAvoidwarpage

Core Design Contradiction:

Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

The patent changes the physical state of the thermal interface material from solid to liquid metal, which fundamentally alters its ability to accommodate warpage. The liquid metal's fluidity allows it to adapt to varying package geometries and warpage conditions that would be impossible for solid materials, directly resolving the contradiction between large package size and warpage control.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent utilizes the liquid phase of metal (typically gallium or gallium-based alloys) which remains liquid at operating temperatures. This phase state enables the thermal interface material to flow and conform to warped surfaces, maintaining effective thermal contact despite the warpage that increases with larger package sizes.

Inventive Principle:

Principle #36Phase transitions

2Ease of manufacture

If solid thermal interface material is used, then manufacturing is simpler, but contact to warped surfaces is poor and heat dissipation is reduced

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidheat dissipation efficiency

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent changes the physical state parameter of the thermal interface material from solid to liquid, which fundamentally improves its ability to conform to warped surfaces. This parameter change enables the material to automatically adapt to surface irregularities, ensuring reliable thermal contact and efficient heat dissipation while maintaining manufacturing simplicity through direct dispensing of the liquid metal.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances heat dissipation by allowing the liquid metal to adapt to surface warpage, reducing voids and improving thermal conductivity compared to solid TIMs.

Implementation Method 1

a liquid-metal-comprising media is dispensed on a package component. In an assembly process, the liquid-metal-comprising media migrates through the permeable plate

Methodology Applied

Scientific EffectCapillary action: Capillary Action

Implementation Method 2

The heat dissipation from the package to the metal lid is thus improved

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

a liquid-metal-comprising media is dispensed on a package component... the liquid metal to adapt to surface warpage, reducing voids and improving thermal conductivity

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS20250349668A1Packages with liquid metal as heat-dissipation media and method forming the same

Publication Date: 2025.11.13 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A method includes attaching a permeable plate to a metal lid, with the permeable plate including a metallic material, and dispensing a liquid-metal-comprising media to a first package component. The first package component is over and bonded to a second package component. The liquid-metal-comprising media includes a liquid metal therein. The method further includes attaching the metal lid to the second package component. During the attaching, the liquid-metal-comprising media migrates into the permeable plate to form a composite thermal interface material.