Liquid Discharge Module Cooling With Segmented Heat Sinks
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing liquid discharge apparatuses, such as ink jet printers, face challenges in effectively cooling substrates, electronic components, and circuits, which limits their productivity and discharge efficiency.
Innovation Solution
A liquid discharge apparatus is designed with a first and second substrate, each equipped with a heat sink and a cooling fan to generate airflow, enhancing heat dissipation and improving cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a plurality of heads with large number of nozzles are used to increase discharge amount per unit time, then productivity is improved, but cooling of substrate, electronic component, and circuit becomes insufficient
Solution Approach 1:
The cooling system is segmented into multiple independent cooling paths: a first cooling path with a first heat sink and first cooling fan for cooling the substrate, and a second cooling path with a second heat sink and second cooling fan for cooling the electronic component. This segmentation allows each cooling path to be optimized independently, enabling effective cooling of multiple heat-generating components simultaneously while maintaining high productivity.
Solution Approach 2:
Heat sinks are introduced as intermediary components between the heat-generating components (substrate and electronic component) and the cooling fans. The heat sinks act as thermal mediators that efficiently transfer heat from the components to the airflow generated by the cooling fans, improving overall cooling efficiency without directly increasing the number of nozzles.
2Adaptability or versatility
If multiple heat-generating components are present, then functionality is improved, but heat management becomes more difficult
Solution Approach 1:
The cooling system is divided into separate modular cooling units, each with its own heat sink and cooling fan. This modular segmentation allows the system to handle multiple heat-generating components independently, making heat management easier despite the increased number of components requiring cooling.
Solution Approach 2:
Each cooling unit (heat sink + cooling fan combination) serves as a universal cooling module that can be applied to different heat-generating components. The first cooling unit cools the substrate while the second cooling unit cools the electronic component, demonstrating multi-functionality in handling diverse thermal management needs within a unified design framework.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves improved cooling of substrates and electronic components, thereby increasing productivity and discharge efficiency by effectively managing heat generation in the liquid discharge process.
Implementation Method 1
a cooling fan that generates an air flow in a gas flow path configured by the first substrate front surface and the second substrate front surface
Implementation Method 2
a first heat sink positioned closer to the first substrate back surface than the first substrate front surface, and attached to the first substrate
Implementation Method 3
a cooling fan that generates an air flow in a gas flow path configured by the first substrate front surface and the second substrate front surface
Data Source
AI summary
There is provide a liquid discharge apparatus including: a first substrate including a first substrate front surface and a first substrate back surface opposite to the first substrate front surface; a second substrate including a second substrate front surface and a second substrate back surface opposite to the second substrate front surface; a first circuit having a first electronic component provided on the first substrate front surface; a second circuit having a second electronic component provided on the second substrate front surface; a cooling fan that generates an air flow in a gas flow path configured by the first substrate front surface and the second substrate front surface; a first heat sink attached to the first substrate; and a second heat sink attached to the second substrate.