Liquid Molding Compound for Semiconductor Chip Edge Protection
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Solution Overview
Problem
Current molding compounds for edge protection of semiconductor chips are prone to cracking or falling off due to weak toughness and low impact resistance, which compromises their effectiveness in advanced packaging manufacturing processes.
Innovation Solution
A liquid molding compound comprising epoxy resin, phenol-formaldehyde resin as a curing agent, epoxy-modified butyronitrile rubber as a toughening agent, silicon dioxide as an inorganic filler, and a silane coupling agent, mixed and ground to form a gel, then vacuum-degassed, to enhance adhesion and impact strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional molding compounds are used for edge protection, then the basic protective function is provided, but the compounds are prone to cracking and falling off due to weak toughness and low impact resistance
Solution Approach 1:
The patent uses a composite formulation combining epoxy resin as the base material with butyronitrile rubber as a toughening agent. The epoxy resin provides structural strength and adhesion, while the butyronitrile rubber phase (present as dispersed droplets) provides toughness and impact resistance through energy absorption during deformation. This composite structure resolves the contradiction by integrating both strong and tough properties in a single material system.
Solution Approach 2:
The patent modifies the chemical composition parameters of the molding compound by incorporating specific ratios of epoxy resin (60-80 parts), butyronitrile rubber (20-40 parts), and curing agents. By adjusting these compositional parameters, the material achieves optimized balance between strength, adhesion, and toughness, preventing both cracking and delamination while maintaining impact resistance.
2Reliability
If conventional molding compounds are used for edge protection, then the basic adhesion is provided, but the adhesion is insufficient leading to delamination
Solution Approach 1:
The patent employs a silane coupling agent as an intermediary substance between the organic epoxy matrix and the inorganic filler particles (such as silica). The silane coupling agent contains both organic functional groups that bond with the epoxy resin and inorganic groups that bond with the filler surface, creating a strong interfacial connection. This intermediary layer prevents delamination and enhances overall bonding strength without compromising adhesion.
3Reliability
If the molding compound has high toughness to prevent cracking, then impact resistance improves, but the compound may become too soft and lose structural integrity
Solution Approach 1:
The patent creates a composite material system where the epoxy resin matrix provides structural strength and rigidity, while the dispersed butyronitrile rubber particles provide toughness and crack resistance. The rigid epoxy continuous phase maintains structural integrity, while the soft rubber inclusions absorb impact energy and prevent crack propagation. This dual-phase composite structure successfully balances strength and toughness without compromising either property.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The compound exhibits significantly improved fracture toughness, impact strength, and silicon adhesion, preventing cracking and falling off, thus providing reliable edge protection for semiconductor chips.
Implementation Method 1
epoxy resin 15 to 40 parts by mass; curing agent 15 to 35 parts by mass
Implementation Method 2
coupling agent 0.1 to 5 parts by mass; the coupling agent may be a silane coupling agent (SCA)
Implementation Method 3
toughening agent 4 to 15 parts by mass; The toughening agent is an adduct of an epoxy resin and a carboxyl-terminated liquid butyronitrile rubber
Implementation Method 4
vacuum-degassed to obtain the liquid molding compound
Data Source
AI summary
A liquid molding compound for protecting five edges of a semiconductor chip and a preparation method thereof are disclosed. The liquid molding compound includes 15 to 40 parts by mass of an epoxy resin, 15 to 35 parts by mass of a curing agent, 0.1 to 3 parts by mass of a curing accelerator, 4 to 15 parts by mass of a toughening agent, 75 to 150 parts by mass of an inorganic filler, and 0.1 to 5 parts by mass of a coupling agent. The epoxy resin is one or more selected from the group consisting of a bisphenol A epoxy resin, a bisphenol F epoxy resin, and a biphenyl epoxy resin. The toughening agent is an adduct of an epoxy resin and a carboxyl-terminated liquid butyronitrile rubber, and the curing agent is a phenol-formaldehyde resin. The molding compound has a low coefficient of thermal expansion (CTE).