Liquid Process Apparatus Top Plate Rotation Resist Removal
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Solution Overview
Problem
The existing resist removing apparatuses face issues with SPM liquid vaporization leading to fume contamination of the processing chamber and wafer, as the SPM liquid tends to reattach to the cover and potentially drop back onto the wafer during the resist removal process.
Innovation Solution
A liquid process apparatus and method featuring a substrate holding unit, a process liquid supply nozzle, a cup to receive the liquid, a top plate for covering the substrate, and a rotating mechanism to prevent reattachment, along with an outside cup peripheral case that moves between positions to contain and direct the process liquid, ensuring it does not reattach to the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the SPM liquid is heated to high temperature for effective resist removal, then the resist removal efficiency is improved, but the SPM liquid vaporizes and generates fumes that contaminate the processing chamber and wafer
Solution Approach 1:
A shielding wall is introduced as an intermediary component between the SPM liquid discharge location and the processing chamber environment. The shielding wall intercepts and contains the SPM liquid and its vapor, preventing direct contamination of the chamber and wafer while allowing the heated liquid to effectively remove resist. This mediator structure resolves the contradiction by isolating the harmful vaporization process from the clean processing environment.
Solution Approach 2:
The shielding wall and cover structure are positioned in advance to prevent fume spread before contamination occurs. By creating a enclosed space with the shielding wall during SPM liquid discharge, the system proactively blocks the propagation of harmful vapors, thereby preventing contamination of the processing chamber and wafer before it can happen.
2Productivity
If the SPM liquid is discharged toward the wafer for resist removal, then the resist removal process is effective, but the SPM liquid attaches to the cover and may drop back onto the wafer causing reattachment contamination
Solution Approach 1:
The cover acts as an intermediary barrier between the SPM liquid and the wafer. When SPM liquid attaches to the cover, the shielding wall and cover structure contain it, preventing direct reattachment to the wafer. The intermediary structures capture and secure the liquid, eliminating the reliability risk while maintaining resist removal effectiveness.
Solution Approach 2:
The shielding wall and cover structure convert the potentially harmful effect of SPM liquid attachment into a beneficial containment mechanism. By allowing the liquid to attach to the cover within the enclosed space, the system prevents uncontrolled dripping and reattachment to the wafer, transforming a reliability risk into a controlled containment feature.
3Object-generated harmful factors
If the shielding wall and cover are used to prevent fume spread, then the contamination of processing chamber is reduced, but the SPM liquid attaches to the cover which increases the risk of reattachment to wafer
Solution Approach 1:
The system uses multiple intermediary structures (shielding wall and cover) that work together to simultaneously achieve fume containment and liquid control. The shielding wall prevents horizontal fume spread, while the cover manages vertical liquid attachment, creating a coordinated intermediary system that resolves both the contamination prevention and reattachment risk issues.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents the reattachment of SPM liquid to the substrate by using a rotating top plate and movable outside cup peripheral case to contain and direct the liquid, reducing contamination within the processing chamber and ensuring efficient resist removal.
Implementation Method 1
a top plate rotation mechanism installed to the top plate and configured to rotate the top plate in a horizontal plane
Implementation Method 2
the SPM liquid heated to a high temperature is discharged toward the wafer. Therefore, in some cases, the SPM liquid is vaporized and thus fumes are generated
Data Source
AI summary
A top plate is provided with a top plate rotation mechanism configured to rotate the top plate in a horizontal plane. An outside cup peripheral case disposed around a cup is configured to move between an upper position, in which a top end of the cylinder is positioned above the cup, and a lower position located below the upper position. A nozzle support arm configured to support a nozzle is moved, in a horizontal direction, between an advanced position, in which the arm is advanced into the outside cup peripheral case via a side opening formed in a side surface of the outside cup peripheral case when the cylinder is located in the upper position, and a retracted position, in which the arm is retracted outward from the outside cup peripheral case.