Liquid Processing Apparatus Flow Resistance Control

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional liquid processing apparatuses face challenges in maintaining a consistent flow rate and concentration of processing liquid, leading to potential electrostatic issues and particle adhesion during substrate processing, especially when processing multiple substrates simultaneously.

Innovation Solution

A liquid processing apparatus with a processing liquid generating unit that includes a solvent supply pipe, a dissolving line, a bypass line, and a resistance changing unit, where the control unit maintains a constant ratio of flow rates through the dissolving and bypass lines, ensuring a predetermined concentration of the processing liquid is maintained across varying substrate processing conditions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the flow rate of processing liquid is reduced to process fewer substrates, then productivity decreases, but the concentration of processing liquid cannot be maintained leading to processing quality degradation

Engineering Contradiction:
Improvenumber of substrates processedVSAvoidprocessing liquid concentration
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The system dynamically adjusts the flow resistance of the bypass line based on the number of substrate processing units operating. When fewer substrates are processed (lower flow rate), the bypass line resistance is increased to maintain the appropriate ratio of processed liquid to fresh solvent, ensuring concentration consistency across varying productivity levels

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The flow resistance parameter of the bypass line is changed according to the operating conditions. By adjusting this parameter, the system maintains a constant ratio of processed liquid to fresh solvent regardless of the total flow rate, thereby preserving processing liquid concentration across different productivity scenarios

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If deionized water is used for substrate processing, then manufacturing precision is improved through high purity, but electrostatic discharge occurs due to high specific resistance

Engineering Contradiction:
Improvesubstrate processing qualityVSAvoidelectrostatic discharge
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The system continuously processes a portion of the processing liquid through the gas dissolver to regenerate its properties. This continuous circulation ensures that the processing liquid consistently maintains low specific resistance and appropriate concentration, preventing electrostatic discharge while preserving processing quality

Inventive Principle:
Principle #20Continuity of useful action

Solution Approach 2:

The processed liquid acts as an intermediary between the gas dissolver and the substrate processing units. By circulating and reprocessing the liquid, the system maintains its electrical conductivity properties, preventing electrostatic buildup while delivering consistent processing quality to substrates

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration ensures a consistent and predetermined concentration of the processing liquid is maintained, even at reduced flow rates, preventing electrostatic issues and ensuring uniform substrate processing across multiple substrate processing units.

Implementation Method 1

a gas dissolver 105 is provided in an intermediate part of gas dissolving line 103

Methodology Applied
Scientific EffectDissolution: Solvation

Data Source

PatentUS8590548B2Liquid processing apparatus for substrate, method for generating processing liquid, and computer readable recording medium storing program for generating processing liquid therein
Publication Date: 2013.11.26 TOKYO ELECTRON LTD
  • US8590548B2 patent drawing
  • US8590548B2 patent drawing
  • US8590548B2 patent drawing

AI summary

Provided is a liquid processing apparatus for a substrate, including a plurality of substrate processing units configured to process the substrate using a processing liquid, a processing liquid generating unit configured to dissolve a gas into a solvent to generate the processing liquid with a predetermined concentration where the processing liquid being supplied to one of the plurality of substrate processing units or being supplied to two or more of the plurality of substrate processing units simultaneously, and a control unit configured to control the plurality of substrate processing units. Also provided are a method for generating the processing liquid and a recording medium storing a program for generating the processing liquid. The liquid processing apparatus generates a processing liquid having a predetermined concentration regardless of the flow rate of the processing liquid used simultaneously.