Liquid Processing Apparatus Holding Part Cleaning
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Solution Overview
Problem
Chemical liquids supplied to substrates often adhere to holding members in substrate processing apparatuses, causing contamination and adverse effects on subsequent substrates during drying processes.
Innovation Solution
A liquid processing method and apparatus that includes rotating the substrate, supplying a chemical liquid, generating and dispersing rinsing liquid droplets using gas, and subsequently providing a rinsing liquid to clean the holding part-side surface, preventing chemical liquid adherence and contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a chemical liquid is supplied to the substrate, then the substrate processing function is improved, but the holding member becomes contaminated with chemical liquid
Solution Approach 1:
A rinsing liquid supply mechanism is provided to supply rinsing liquid to the holding member before the substrate is transferred back, preliminarily removing chemical liquid from the holding member surface. This preliminary cleaning action prevents contamination transfer to subsequent substrates while maintaining the substrate processing function.
Solution Approach 2:
A rinsing liquid is introduced as an intermediary substance between the chemical liquid treatment and substrate transfer processes. The rinsing liquid acts as a mediator to wash away chemical liquid residues from the holding member, preventing direct transfer of harmful chemical liquid to the substrate.
2Productivity
If the substrate is rotated at high speed, then the processing throughput is improved, but the chemical liquid scatters more widely and adheres to the base member
Solution Approach 1:
The harmful scattering effect of chemical liquid caused by high-speed rotation is extracted and addressed separately through a dedicated rinsing liquid supply mechanism. The rinsing liquid is supplied to the holding member area to remove scattered chemical liquid residues, separating the throughput enhancement function from the contamination control function.
Solution Approach 2:
The scattering of chemical liquid, which is normally a harmful effect, is converted into a beneficial rinsing action. The scattered chemical liquid is used to pre-wet the holding member and base member surfaces, and then the rinsing liquid effectively removes these residues, turning the scattering problem into an opportunity for comprehensive surface coverage and efficient cleaning.
3Object-affected harmful factors
If a cleaning liquid is supplied to the base member, then the contamination is removed, but the processing time increases
Solution Approach 1:
The rinsing liquid supply to the holding member and base member is performed as a preliminary action during the substrate rotation process, before the substrate transfer is completed. This preliminary cleaning integrates the cleaning function into the existing processing cycle, removing contamination without adding separate cleaning steps and thus minimizing processing time increase.
Solution Approach 2:
The cleaning function is merged with the substrate processing function. The rinsing liquid supply mechanism operates simultaneously with the substrate rotation and processing, combining the cleaning action with the existing processing cycle. This integration allows contamination removal to occur during the normal processing time without requiring additional dedicated cleaning time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively cleans holding members and prevents chemical liquid adherence to substrates, ensuring high throughput and preventing pollution during substrate processing.
Implementation Method 1
supplying gas toward the holding part-side surface of the substrate by a gas supply part after the chemical liquid supply, supplying a rinsing liquid toward the holding part-side surface of the substrate by a rinsing liquid supply part to generate rinsing liquid droplets
Implementation Method 2
rotating the substrate held by the holding part through a rotation driving part
Data Source
AI summary
Disclosed is a liquid processing method which includes holding the substrate by a holding part, rotating the substrate held by the holding part through a rotation driving part, and supplying a chemical liquid to a holding part-side surface of the substrate by a chemical liquid supply part. After the supply of the chemical liquid, rinsing liquid droplets are generated and supplied between the holding part and the substrate by supplying gas toward the holding part-side surface of the substrate from a gas supply part and, at the same time, supplying a rinsing liquid toward the holding part-side surface of the substrate from a rinsing liquid supply part. After the supply of the rinsing liquid droplets, the gas supply is halted and a rinsing liquid is additionally supplied to the holding part-side surface of the substrate from the rinsing liquid supply part.