Liquid Processing Apparatus with Substrate-Selective Light Heating
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor and flat panel display manufacturing, substrates with high aspect ratio holes or patterns face challenges in completely removing processing liquids during rinsing, leading to prolonged rinsing times due to the difficulty in substituting processing liquids with rinsing liquids, especially when the aspect ratio is high.
Innovation Solution
A liquid processing apparatus that includes a substrate holder, processing liquid supply unit, rinsing liquid supply unit, and a light emitting element that emits light absorbed only by the substrate, heating the processing liquid within holes or patterns to increase its diffusion coefficient, facilitating mixing with rinsing liquid and efficient removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If rinsing time is increased to remove processing liquid from high aspect ratio holes or patterns, then cleaning completeness is improved, but productivity deteriorates
Solution Approach 1:
The patent applies parameter changes by irradiating light of a specific wavelength range onto the substrate during rinsing. This light irradiation changes the temperature parameter of the processing liquid remaining in high aspect ratio holes or patterns, causing it to heat up and expand. The thermal expansion and increased temperature reduce the viscosity and surface tension of the processing liquid, making it easier to be replaced by rinsing liquid and removed from the substrate, thereby achieving complete cleaning without extending rinsing time.
Solution Approach 2:
The patent implements periodic action by controlling the light emitting element to irradiate light onto the substrate at specific stages of the rinsing process. The light irradiation is applied periodically or continuously during the rinsing period, creating thermal cycles that enhance the mixing and replacement of processing liquid with rinsing liquid in high aspect ratio structures, thus improving cleaning efficiency without increasing overall process time.
2Productivity
If light emitting element is added to heat processing liquid, then rinsing efficiency is improved, but device complexity increases
Solution Approach 1:
The patent replaces mechanical heating systems with an optical system. Instead of using conventional heating elements, hot plates, or thermal conduction methods, the invention uses a light emitting element (such as LED or laser) to irradiate light of a specific wavelength range onto the substrate. The processing liquid absorbs this light energy and converts it to thermal energy, achieving heating without direct mechanical contact or complex thermal management systems.
Solution Approach 2:
The patent utilizes phase transitions and thermal effects by selecting light wavelengths that are strongly absorbed by the processing liquid. The absorbed light energy causes rapid local heating, which can induce thermal expansion, convection currents, and changes in liquid properties. These phase-related transitions enhance the mixing and replacement of liquids in high aspect ratio structures, improving rinsing efficiency with minimal additional device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus significantly reduces processing time by enhancing the mixing and removal of processing liquids with rinsing liquids, even in substrates with high aspect ratio features, through controlled heating and convection, thereby improving rinsing efficiency.
Implementation Method 1
a light emitting element that emits light of a wavelength range, which is absorbed only by the substrate, and irradiate the emitted light to the substrate
Implementation Method 2
the light emitting element heats the processing liquid within the hole portion or the pattern by heating the substrate using the light of the wavelength range
Implementation Method 3
a diffusion coefficient of the heated processing liquid is increased to easily mix the heated processing liquid and the rinsing liquid
Implementation Method 4
as a result a diffusion coefficient of the heated processing liquid is increased to easily mix the heated processing liquid and the rinsing liquid
Data Source
AI summary
Disclosed is a liquid processing apparatus that processes a substrate with a processing liquid. The processing apparatus includes: a substrate holder configured to hold the substrate; a processing liquid supply unit configured to supply the processing liquid to the substrate held by the substrate holder; a rinsing liquid supply unit configured to supply a rinsing liquid to the substrate; and a light emitting element configured to emit light of a wavelength range, which is absorbed only by the substrate, and irradiate the emitted light to the substrate.


