Liquid Processing Nozzle Angles for Substrate Cleaning
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing liquid processing methods face challenges in effectively cleaning the peripheral parts of substrates, particularly when using organic solvents like IPA, as they tend to form thin liquid films that trap dissolution products, leading to development defects and reduced device yield due to liquid splashing at high rotational speeds.
Innovation Solution
A method involving a substrate held horizontally with a processing liquid nozzle discharging IPA obliquely along the tangential direction and a gas nozzle discharging perpendicularly adjacent to the IPA landing position, both moved from the center to the periphery, to manage the liquid film and prevent splashing, ensuring thorough cleaning and defect reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the substrate rotates at high speed to improve processing efficiency, then productivity increases, but liquid splashing occurs and cleaning quality deteriorates
Solution Approach 1:
The patent applies dynamics by making the nozzle movable rather than stationary. The nozzle moves in coordination with the substrate rotation, maintaining optimal positioning relative to the liquid film. This dynamic adjustment allows the system to operate at high rotational speeds while preserving cleaning quality by adapting the nozzle position to the changing conditions.
Solution Approach 2:
The patent changes physical parameters including the discharge angle of the processing liquid (oblique discharge along tangential direction) and the positioning of the gas nozzle relative to the liquid landing position. These parameter adjustments optimize the liquid film formation and gas-liquid interaction, enabling effective cleaning at high rotational speeds without splashing.
2Ease of manufacture
If a processing liquid nozzle discharges liquid perpendicular to the substrate surface, then the liquid application is simple, but liquid splashing increases and cleaning effectiveness decreases
Solution Approach 1:
The patent changes the discharge angle parameter from perpendicular (0 degrees from normal) to oblique (along tangential direction). This parameter modification allows the processing liquid to follow the substrate surface more effectively, forming a uniform liquid film without splashing, thereby improving cleaning effectiveness while maintaining reasonable operational simplicity.
3Device complexity
If the gas nozzle is positioned far from the liquid landing position, then the nozzle structure is simple, but dissolution products remain trapped and development defects increase
Solution Approach 1:
The patent applies local quality by positioning the gas nozzle specifically at the liquid landing position on the substrate surface. This localized positioning ensures that gas flow is applied exactly where the liquid film forms, maximizing the removal of dissolution products at the critical interface. The precise local positioning eliminates defects without requiring complex overall nozzle structures.
Solution Approach 2:
The gas acts as an intermediary between the processing liquid and the substrate surface. By discharging gas at the liquid landing position, the gas mediates the interaction between liquid and substrate, facilitating the removal of dissolution products and preventing their accumulation, thereby reducing development defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses liquid splashing and enhances the cleaning process, reducing development defects and improving yield by maintaining a controlled liquid film and efficiently removing dissolution products from the substrate's surface, even at increased rotational speeds.
Implementation Method 1
discharging a gas from a gas nozzle perpendicularly with respect to the surface of the substrate
Implementation Method 2
the processing liquid is discharged to the peripheral portion of the substrate obliquely with respect to a surface of the substrate and along a tangential direction of the substrate
Data Source
AI summary
A liquid processing apparatus for liquid-processing a substrate includes a substrate holding device that rotates a substrate in horizontal position, a nozzle holding device holding processing liquid and gas nozzles, the liquid nozzle discharging processing liquid from a discharge port such that the liquid is discharged obliquely to surface of the substrate, the gas nozzle discharging gas perpendicularly to the surface of the substrate, a moving device that moves the nozzle device with respect to the surface of the substrate, and a control device including circuitry that controls the nozzle, substrate and moving devices such that while the substrate is rotated, the liquid is discharged to peripheral portion toward downstream side in rotation direction and along tangential direction of the substrate and gas is discharged from the gas nozzle toward position adjacent to liquid landing position of the liquid on the surface and is on center side of the substrate.